The thermal management of printed circuit boards is of increasing importanceas the power density of components and circuits continues to rise. Thesituation is complicated by the use of boards with multiple sheets of copperembedded in…read more
The need for a change in thermal design philosophy
October 1st, 1995
Figure 1: Standard situation Figure 2: Required situation Introduction The future of many electronic companies will depend to a large extent ontheir ability to initiate techniques that bring schedules, performance, tests,support, production, life cycle costs,…read more
Specifying filters for forced convection cooling
October 1st, 1995
Introduction The importance and utility of air filters is often underestimated since itis typically an after-thought in the design cycle. The wrong filter is oftenused for an application which may compromise the electrical and thermalperformance…read more
Making surface temperature measurements using liquid crystal thermography
October 1st, 1995
Introduction The development of liquid crystal (LC) based thermography overthe past 30 years has provided thermal engineers with a relatively inexpensivetechnique for visualizing and measuring surface temperature. Engineers andscientists have successfully used LC thermography to…read more
Fan cooled enclosure analysis using a first order method
October 1st, 1995
Introduction Most Electronics Packaging Engineers and Analysis Specialists have access toa wide range of high quality analysis tools. While a few computer programs useanalytical methods, the majority are based on numerical analysis techniques.Although these programs…read more
Safety tips and techniques for FEA in modeling solids
June 1st, 1995
Using commercially available finite element analysis (FEA) software is easier today than it has ever been. Software vendors have made great progress toward providing programs that are as easy to use as they are powerful.…read more
Radial nozzles
June 1st, 1995
In a quest to increase surface heat removal rates for electronics packaging, impinging jet cooling promises to be effective and inexpensive. Most impingement cooling systems use open pipes. These are effective but have drawbacks such…read more
How to select a heat sink
June 1st, 1995
With the increase in heat dissipation from microelectronics devices and thereduction in overall form factors, thermal management becomes a more a moreimportant element of electronic product design. Both the performance reliability and life expectancy of…read more
Evaluation of different heat transfer coefficient definitions
June 1st, 1995
The analysis of convective heat transfer problems pivots on the accurate knowledge of the heat transfer coefficient, h. The heat transfer coefficient is affected by many parameters which have been defined differently by various investigators.…read more
Elements of device thermal characterization
June 1st, 1995
The increased power dissipation of today’s integrated circuits has made knowledge of thermal resistance important to those who manufacture and use these devices. Thermal resistance is a device (i.e. semiconductor chip mounted in a package)…read more
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