1996

  • Jan
  • Feb
  • Mar
  • Apr
  • May
  • Jun
  • Jul
  • Aug
  • Sep
  • Oct
  • Nov
  • Dec

Thermal resistance of interface materials as a function of pressure

September 1st, 1996

A very large factor in reducing thermal interface resistance is theapplication of pressure. Even though much effort in recent years has beendevoted to improving the thermal conductivity of interface materials, thethermal conductivity of a material…read more

Thermal Interface Materials

September 1st, 1996

Thermattach thermally conductive adhesivetapes Introduction Today’s semiconductors, whether discrete power or logic ICs, are smaller,run faster, do more and generate more heat. Some microprocessors dissipatepower levels that were once the exclusive domain of discrete power…read more

Thermal control of space electronics

September 1st, 1996

Introduction Telecommunication satellites are all based on the same overall design usinga 3 axis stabilization process, in which the North and South panels act asradiators and so ensure heat removal. This basic principle is illustrated…read more

Heat Pipes for Electronics Cooling Applications

September 1st, 1996

Figure 1: Heat pipe operation Introduction All electronic components, from microprocessors to high end powerconverters, generate heat and rejection of this heat is necessary for theiroptimum and reliable operation. As electronic design allows higher throughputin…read more

An introduction to thermoelectric coolers

September 1st, 1996

Figure 1: Cross Section of a Typical TECouple Introduction Thermoelectric coolers are solid state heat pumps used in applications wheretemperature stabilization, temperature cycling, or cooling below ambient arerequired. There are many products using thermoelectric coolers,…read more

Thermoelectric thermal regulation systems

May 1st, 1996

Thermoelectric temperature control systems are being used in an increasingnumber of applications. Typical applications of these systems are in thermalregulation of electronic enclosures, recirculating chillers for laser cooling,semiconductor process control and management of patient hypo-…read more

Minimizing acoustical noise in electronic systems

May 1st, 1996

Introduction Air-moving devices (AMDs), such as fans and blowers used for cooling inelectronic systems invariably generate acoustical noise which must be consideredif people are exposed to the emitted noise. In this article, we discussquantitative measures…read more

How to evaluate fan life

May 1st, 1996

Convection air cooling is still the most commonly used method of coolingmicroelectronics. In order to deliver air cooled computer equipment with higherreliability, we need to focus on the life expectancy of the air moving devices(AMDs).…read more

Direct liquid immersion cooling for high power density microelectronics

May 1st, 1996

Introduction Since the development of the first electronic computers in the 1940s, thedevelopment of faster and denser circuit technologies and packages has beenaccompanied by increasing heat fluxes at the chip and package levels. Over theyears,…read more

All you need to know about fans

May 1st, 1996

A Basic Fan/Blower Description Fans can be thought of as low pressure air pumps that utilize power from amotor to output a volumetric flow of air at a given pressure. A propellerconverts torque from the…read more

Why the traditional reliability prediction models do not work – is there an alternative?

January 1st, 1996

Introduction While it is generally believed that reliability prediction methods should beused to aid product design and product development, the integrity andauditability of the traditional prediction methods have been found to bequestionable, in that the…read more

Environmental stress testing – a product improvement method

January 1st, 1996

Introduction and Summary In today’s competitive environment, the electronics industry is focusing onbusiness process re-engineering or product improvements with emphasis ondevelopment and manufacturing intervals and costs, warranty costs, fieldreliability, and customer maintenance costs. Some of…read more

Electronic package characterization per JEDEC standard

January 1st, 1996

Introduction With the increase in power density resulting from advancements insemiconductor packaging technologies comes the issue of heat dissipation. Heatis generated as a result of electrical energy being converted to thermal energyduring circuit activities. The…read more

DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts

January 1st, 1996

The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development…read more