Introduction This paper will discuss a new approach to the measurement of the thermal properties of PCBs and the packages mounted to them. It is intended to replace traditional solutions, such as using thermocouples and…read more
The thermal conductivity of gases
September 1st, 1998
The value of thermal conductivity for most gases and vapors range between 0.01 and 0.03 W/mK at room temperature. Notable exceptions are Helium (0.15) and Hydrogen (0.18). The most common theoretical explanation of heat conduction…read more
Recent Japanese thermal solutions for portable computers
September 1st, 1998
Introduction Mobile computing is poised to shape the way we live our lives, allowing people to generate, retrieve, and process data anywhere and at any time. The infrastructure for mobile computing is rapidly developing, as…read more
Heat transfer measurements in electronics cooling applications
September 1st, 1998
Introduction Increased performance in electronic systems along with higher packaging densities have made temperature a critical parameter. Measurements of temperature, velocity and heat transfer in electronic systems are challenging due to complex materials, configurations, and…read more
Disk drive reliability and thermal management
September 1st, 1998
Disk drive reliability and thermal management Hard disk drives are electromechanical systems which store information. They are the most complex electronic sub-assembly within a computer. If a microprocessor can qualify as the “heart” of a…read more
Cooling electronics at high altitudes made easy
September 1st, 1998
Introduction High altitude air cooling has always been somewhat of a mystery to the uninformed. The first reaction to the situation is that there is just not enough air at altitudes greater than six kilometers…read more
Convection and radiation heat loss from a printed circuit board
September 1st, 1998
In last issue’s column, a method for calculating the thermal conductivity of a printed circuit board (PCB) was described. Now, we look at a more complicated heat transfer process, namely the loss of heat from…read more
Thermal management of handheld telecommunication products
May 1st, 1998
Introduction Recent advances in mobile communications have enabled large scale development of handheld telecommunication products. Such products include cellular phones, pagers, two-way radios, personal digital assistants (PDAs), and other wireless and wireline equipment. The technological…read more
Thermal interface under a plastic quad flat pack
May 1st, 1998
Introduction Plastic components are designed so that the heat is dissipated by forced or natural convection. The use of plastic packages under conditions where neither cooling method is available introduces new challenges. High heat-dissipation plastic…read more
The thermal conductivity of silicon
May 1st, 1998
The most important material within the semiconductor industry is Silicon. When dealing with electro-thermal device modelling, or the interpretation of fast transient techniques for the measurement of thermal impedance, thermal conductivity of Silicon is required.…read more
Pressure drop coefficients for thin perforated plates
May 1st, 1998
Almost everyone working on pressure drop coefficients of perforated plates encounters the work of I.E. Idelchick {1}. A plethora of graphs or equations – some of which are impossible to evaluate quickly – must then…read more
Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example
May 1st, 1998
Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal…read more
Forced convection cooling inside an electronics enclosure
May 1st, 1998
Introduction One of the more complex thermal problems in electronics is the modeling of complete systems, such as an enclosure containing electronic components. A typical example would be a power supply, including heat sinks and…read more
Conduction heat transfer in a printed circuit board
May 1st, 1998
In this issue, we examine heat flow in a printed circuit board (PCB), which typically is a layered composite consisting of copper foil and a glass-reinforced polymer (FR-4). A cross-sectional view of such a laminated…read more
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