Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated…read more
Thermal management of highly integrated electronic packages in avionics applications
November 1st, 2001
The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic…read more
The thermal conductivity of rubbers/elastomers
November 1st, 2001
In the May 2001 issue, this column discussed the thermal conductivity of unfilled plastics. The interested reader may have noticed that the category of rubbers/elastomers was missing. This was not without reason. The user of…read more
Temperature and reliability in electronics systems – the missing link
November 1st, 2001
To introduce the reliability requirements we face for the future, we focus on telecommunication as an example. Personal telecommunication is becoming increasingly integrated into our daily lives. However, we cannot take full advantage of the…read more
Noise emission of telecommunication devices
November 1st, 2001
Modern environmental requirements demand low noise levels for telecommunication cabinet products, especially when located in offices or urban areas. The spaces available are limited, and the power and electronics packaging density are increasing. Fans are…read more
Vapor Compression Cooling for High Performance Applications
August 1st, 2001
Vapor compression refrigeration is being adapted to cool computer and telecommunications equipment in a limited number of high performance applications. Vapor compression can lift large heat loads and can heat sink at below ambient temperatures.…read more
Use of Naphthalene Sublimation Technique for Obtaining Accurate Heat Transfer Coefficients in Electronic Cooling Applications
August 1st, 2001
The naphthalene sublimation technique has been demonstrated by a number of investigators to be an excellent method for obtaining heat transfer results [1,2] and a few have applied this technique to applications focused on electronic…read more
The Role of Natural Graphite in Electronics Cooling
August 1st, 2001
Graphite is available as a variety of different material forms, the most useful in the electronics cooling market being pyrolytic graphite, graphite fiber reinforced carbon and polymer matrix composites, graphite foams and, the subject of…read more
The Challenge of Operating Computers at Ultra-low Temperatures
August 1st, 2001
Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance.…read more
The Anisotropic Thermal Conductivity of Plastics
August 1st, 2001
The easiest way to tailor thermal conductivity of plastics is to incorporate some highly thermal conductive filler material into the plastic molding compound. Here the filler particles act as heat carriers in the thermally isolating…read more
Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate
August 1st, 2001
Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is…read more
Dimensional Analysis for Package Designers
August 1st, 2001
The care with which we express the dimensions of important parameters makes the difference between conveying useful information or conveying useless or misleading data. Taking the issue of units one more step, the purpose of…read more
Visualization of air flows in electronics systems
May 1st, 2001
The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple…read more
The thermal conductivity of unfilled plastics
May 1st, 2001
This time, the focus is on the thermal conductivity of unfilled plastics. There are hundreds of them, so only a small selection can be presented. From a thermal point of view, plastics are a notoriously…read more
Recent Posts
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