2001

Thermomechanical stress modeling in microelectronics and photonics

November 1st, 2001

Thermomechanical stresses and deformations are the major contributors to malfunctions of, and failures in, microelectronics and photonics devices, packages and systems. In microelectronics, the most serious consequences of the elevated thermal stresses are usually associated…read more

Thermal management of highly integrated electronic packages in avionics applications

November 1st, 2001

The packaging and thermal management of electronic equipment has become an important issue because of increased power levels and the simultaneous miniaturization of the devices. With the advent of denser device packaging and faster intrinsic…read more

The thermal conductivity of rubbers/elastomers

November 1st, 2001

In the May 2001 issue, this column discussed the thermal conductivity of unfilled plastics. The interested reader may have noticed that the category of rubbers/elastomers was missing. This was not without reason. The user of…read more

Temperature and reliability in electronics systems – the missing link

November 1st, 2001

To introduce the reliability requirements we face for the future, we focus on telecommunication as an example. Personal telecommunication is becoming increasingly integrated into our daily lives. However, we cannot take full advantage of the…read more

Noise emission of telecommunication devices

November 1st, 2001

Modern environmental requirements demand low noise levels for telecommunication cabinet products, especially when located in offices or urban areas. The spaces available are limited, and the power and electronics packaging density are increasing. Fans are…read more

Vapor Compression Cooling for High Performance Applications

August 1st, 2001

Vapor compression refrigeration is being adapted to cool computer and telecommunications equipment in a limited number of high performance applications. Vapor compression can lift large heat loads and can heat sink at below ambient temperatures.…read more

Use of Naphthalene Sublimation Technique for Obtaining Accurate Heat Transfer Coefficients in Electronic Cooling Applications

August 1st, 2001

The naphthalene sublimation technique has been demonstrated by a number of investigators to be an excellent method for obtaining heat transfer results [1,2] and a few have applied this technique to applications focused on electronic…read more

The Role of Natural Graphite in Electronics Cooling

August 1st, 2001

Graphite is available as a variety of different material forms, the most useful in the electronics cooling market being pyrolytic graphite, graphite fiber reinforced carbon and polymer matrix composites, graphite foams and, the subject of…read more

The Challenge of Operating Computers at Ultra-low Temperatures

August 1st, 2001

Although the potential for low temperature enhancement of CMOS circuit performance has been recognized for some time, circuit scaling (proportionally reducing the size of the circuit) has been the preferred method of achieving higher performance.…read more

The Anisotropic Thermal Conductivity of Plastics

August 1st, 2001

The easiest way to tailor thermal conductivity of plastics is to incorporate some highly thermal conductive filler material into the plastic molding compound. Here the filler particles act as heat carriers in the thermally isolating…read more

Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate

August 1st, 2001

Although most of the emphasis today in the electronics cooling community is devoted to extending forced convection cooling capability, many applications still depend upon natural convection cooling. Basically, natural convection cooling combined with radiation is…read more

Dimensional Analysis for Package Designers

August 1st, 2001

The care with which we express the dimensions of important parameters makes the difference between conveying useful information or conveying useless or misleading data. Taking the issue of units one more step, the purpose of…read more

Visualization of air flows in electronics systems

May 1st, 2001

The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple…read more

The thermal conductivity of unfilled plastics

May 1st, 2001

This time, the focus is on the thermal conductivity of unfilled plastics. There are hundreds of them, so only a small selection can be presented. From a thermal point of view, plastics are a notoriously…read more