Comments on: Toward A Thermal Figure Of Merit For Multi-Chip Packages http://www.electronics-cooling.com/2006/11/toward-a-thermal-figure-of-merit-for-multi-chip-packages/ Dedicated to Thermal Management in the Electronics Industry Tue, 31 Jan 2012 20:43:24 +0000 hourly 1 http://wordpress.org/?v=3.2 By: N9ZN-Extra http://www.electronics-cooling.com/2006/11/toward-a-thermal-figure-of-merit-for-multi-chip-packages/comment-page-1/#comment-5014 N9ZN-Extra Wed, 06 Jul 2011 09:18:29 +0000 http://www.electronics-cooling.com/?p=347#comment-5014 I do not understand the terminology differences. Is MCP = Multi Chip Package or Media Control Processor? Is SPP = Single Chip Package or System Platform Processor? Usage of acronyms to describe the different things in the same environment are simply not well understood. What is your take on this? I do not understand the terminology differences.

Is MCP = Multi Chip Package or Media Control Processor?
Is SPP = Single Chip Package or System Platform Processor?

Usage of acronyms to describe the different things in the same environment are simply not well understood. What is your take on this?

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