Introduction This Calculation Corner continues Part I, published in the previous issue [1]. Part I described the construction of a typical flip-chip package configuration for high-power chips, consisting of a laminate assembly of materials adhesively…read more
Thermal Effusivity
November 1st, 2007
The Technical Data column of the previous issue discussed the concept of thermal diffusivity. It makes sense to discuss in this issue a related topic: thermal effusivity. While thermal diffusivity, a, is defined as the…read more
Reliability Testing Of Thermal Greases
November 1st, 2007
Introduction Thermal Interface Materials (TIMs) play a key role in the thermal management of electronic systems by providing a path of low thermal resistance between the heat generating devices and the heat spreader/sink. Typical TIM…read more
Providing More Value Than Playing Video Games
November 1st, 2007
ElectronicsCooling magazine was founded more than 12 years ago with a mission of providing current and practical thermal management information with archival value. I hope you agree this magazine is still delivering on its original…read more
Electronics Cooling At Higher Pressures … a Positive Displacement Pump Solution
November 1st, 2007
Introduction Many liquid cooling solutions in use today employ cooling system devices that result in system pressure drops limited to <0.5 bar (7.25 psi), which allows these systems to fit within the limits of centrifugal…read more
Advanced Cooling Using Meso-Scale Evaporative Cold Plates
November 1st, 2007
Introduction Thermal management of servers and communications equipment has become significantly more challenging over the past several years. As is well known, processor powers have increased to 150 W or more and are projected to…read more
A Practical Implementation Of Silicon Microchannel Coolers
November 1st, 2007
Introduction More than twenty-five years ago, Tuckerman and Pease first described the use of silicon microchannel cooling for very high power densities [1]. However, the coolers could not be fabricated easily and pressure drops were…read more
Top 20 Considerations For Selecting Thermal Interface Materials
August 1st, 2007
Introduction Heat is often considered the limiting factor in the advancement of electronics systems. Lower thermal resistance will drive, not follow, future electronic designs. These solutions must be cost effective, user friendly and developed quickly.…read more
Thermal Strain In Semiconductor Packages, Part I
August 1st, 2007
Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low,…read more
Thermal Diffusivity
August 1st, 2007
Thermal diffusivity is a measure of the transient thermal response of a material to a change in temperature and the term thermal diffusivity (α) is defined as α = k/(ρ x cp) where α is…read more
Thanks and Congratulations
August 1st, 2007
Since the first issue of ElectronicsCooling magazine emerged in June 1995, I have had the privilege of publishing a number of feature articles in the magazine. Writing these articles came relatively easy because the topics…read more
Design For Manufacturability Of Forced Convection Air Cooled Fully Ducted Heat Sinks
August 1st, 2007
Introduction The requisite thermal management for a microprocessor is most often achieved via an aluminum heat sink (fin structure) and a small fan. The effort discussed herein deals with the development of a ‘design for…read more
Comparison Of Heat Transfer Rates Of Different Nanofluids On The Basis Of The Mouromtseff Number
August 1st, 2007
Nanofluids are dispersions of nanometer-sized particles in a base fluid such as water, ethylene glycol or propylene glycol. In the last decade, nanofluids have attracted more attention as a new generation of coolants for various…read more
Air-Cooled, Pin Fin Coldwall Design For Operation At Altitude
August 1st, 2007
Introduction Numerous thermal management techniques exist depending on the system, application, and power level. For airborne electronic systems, the most direct approach to thermal management would be to use ambient air or chilled air, provided…read more
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