2008

Pushing the Boundaries of Heat Pipe Operation

November 1st, 2008

 Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures…read more

Power Map Calculations Using Image Sources and Superposition

November 1st, 2008

Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more…read more

Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management

November 1st, 2008

Introduction Due to the increasing power density in today’s industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and…read more

Giving Back

November 1st, 2008

haring, Tech nical knowledgeThe A&D group represents a large number of subscribers but their contribution rate measured against authored articles in ElectronicsCooling is underrepresented. Soliciting targeted articles from my coworkers within this industry group has…read more

Emissivity in Practical Numerical Modeling

November 1st, 2008

In the August 2003 issue, the Technical Data column was devoted to emissivity in practical temperature measurements. But what about the emissivity value that should be entered in your numerical model? Can we use the…read more

Advanced Metal Diamond Composites – Love and Heat Relationship

November 1st, 2008

Introduction Thermal management is a critical issue in high-power laser diode and LED packages, and microprocessor units [1, 2]. Reliability and long life time of electronic packages call not only for materials with high thermal…read more

A Cryocooler In Your Laptop Computer? Maybe…

November 1st, 2008

Introduction A review of the technical and market impediments overcome in the development and eventual acceptance of cryocoolers for space-borne applications may shine light on the prospects for the use of such mechanical refrigeration systems…read more

Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems

August 1st, 2008

Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, “gaming” PCs, or tower servers that utilize…read more

Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks

August 1st, 2008

Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or…read more

Reader Poll Declares ElectronicsCooling a Winner!

August 1st, 2008

Reader Poll Declares ElectronicsCooling a Winner! Here in the United States we are in the midst of the campaign season leading to our national election in November to choose our next president. While Senator John…read more

Liquid Cooling for Datacom Equipment Centers

August 1st, 2008

Introduction The increasing heat load densities in datacom equipment centers require ever more sophisticated approaches to cooling. Air-cooled systems are now struggling to provide the needed level of thermal performance for many installations and energy…read more

Heat Spreading Calculations Using Thermal Circuit Elements

August 1st, 2008

Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of…read more

Heat of Vaporization

August 1st, 2008

Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data…read more

A Simple Method To Estimate The Physical Characteristics Of A Thermoelectric Cooler From Vendor Datasheets

August 1st, 2008

Introduction A thermoelectric cooler (TEC) is a solid-state refrigerator that operates on the Peltier effect. The absence of moving parts, compact size, precise temperature control ability and reliability all combine to make the TEC a…read more