Introduction Heat pipes are well-established two-phase devices used in the electronics cooling industry to transport heat from the point it is generated to the place where it is extracted from the system. Three wick structures…read more
Power Map Calculations Using Image Sources and Superposition
November 1st, 2008
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more…read more
Integrated Heat Pipe Spreader for Improved FBDIMM Memory Module Thermal Management
November 1st, 2008
Introduction Due to the increasing power density in today’s industry standard servers, thermal design and cooling is a significant challenge. In a typical server, the two most challenging elements to cool are the processors and…read more
Giving Back
November 1st, 2008
haring, Tech nical knowledgeThe A&D group represents a large number of subscribers but their contribution rate measured against authored articles in ElectronicsCooling is underrepresented. Soliciting targeted articles from my coworkers within this industry group has…read more
Emissivity in Practical Numerical Modeling
November 1st, 2008
In the August 2003 issue, the Technical Data column was devoted to emissivity in practical temperature measurements. But what about the emissivity value that should be entered in your numerical model? Can we use the…read more
A Cryocooler In Your Laptop Computer? Maybe…
November 1st, 2008
Introduction A review of the technical and market impediments overcome in the development and eventual acceptance of cryocoolers for space-borne applications may shine light on the prospects for the use of such mechanical refrigeration systems…read more
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
August 1st, 2008
Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, “gaming” PCs, or tower servers that utilize…read more
Simplified Correlations For Radiation Heat Transfer Rate In Plate-Fin Heat Sinks
August 1st, 2008
Radiation heat transfer can be a significant portion of total heat transfer from a heat sink, particularly in natural convection flows. The enclosures for most natural-convection-cooled indoor and outdoor electronic equipments, such as pole or…read more
Reader Poll Declares ElectronicsCooling a Winner!
August 1st, 2008
Reader Poll Declares ElectronicsCooling a Winner! Here in the United States we are in the midst of the campaign season leading to our national election in November to choose our next president. While Senator John…read more
Liquid Cooling for Datacom Equipment Centers
August 1st, 2008
Introduction The increasing heat load densities in datacom equipment centers require ever more sophisticated approaches to cooling. Air-cooled systems are now struggling to provide the needed level of thermal performance for many installations and energy…read more
Heat Spreading Calculations Using Thermal Circuit Elements
August 1st, 2008
Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of…read more
Heat of Vaporization
August 1st, 2008
Thermal energy transfer associated with a change of phase can be a valuable phenomenon for engineers designing systems for electronics cooling. Solid to liquid phase change materials were described in the May 2005 Technical Data…read more
A Simple Method To Estimate The Physical Characteristics Of A Thermoelectric Cooler From Vendor Datasheets
August 1st, 2008
Introduction A thermoelectric cooler (TEC) is a solid-state refrigerator that operates on the Peltier effect. The absence of moving parts, compact size, precise temperature control ability and reliability all combine to make the TEC a…read more
Recent Posts
- Thermal Spreading and More Using Open-Source FEA Software
- Two-Phase Flow Control of On-Chip Two-Phase Cooling Systems Developed for Blade Servers of Data Centers
- Thermal Facts and Fairy Tales: A System Perspective for Electronics Cooling
- Electronic Performance Impact of Elevated Humidity Environments — Implications for Free Air Cooling of Data Centers
- Epoxy Meets UL94V-0 Specifications
- Why Not Just Shove a Heatsink on Top of it? Part 2: Heat Flow Budgets
- New PWM Version of Fan Released
- Revisions for CPU Coolers for Intel Xeon
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