http://www.electronics-cooling.com/2008/05/on-the-challenges-of-thermal-characterization-of-high-power-high-brightness-led-packages/ Dedicated to Thermal Management in the Electronics Industry Tue, 31 Jan 2012 20:43:24 +0000 hourly 1 http://wordpress.org/?v=3.2 http://www.electronics-cooling.com/2008/05/on-the-challenges-of-thermal-characterization-of-high-power-high-brightness-led-packages/comment-page-1/#comment-6480 Jim Corzoni Tue, 31 Jan 2012 20:43:24 +0000 http://www.electronics-cooling.com/?p=385#comment-6480 Although this paper provides some useful insight to die measurement techniques, It would be better that you give the thermal resistances of the external elements like the heatsink, bonding method... etc. I am trying to figure out the thermal resistance of the die to the die's mounting surface to see the limits on packaging. Although this paper provides some useful insight to die measurement techniques, It would be better that you give the thermal resistances of the external elements like the heatsink, bonding method… etc. I am trying to figure out the thermal resistance of the die to the die’s mounting surface to see the limits on packaging.

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