November, 2009

Next stop on the avenue of package thermal modelling is 2 resistor CTMs (compact thermal models). Specifically Theta_jb and Theta_jc, the thermal resistance between junction and board and junction and case respectively. Unlike their lowly 1R cousins these two resistances do not purport to include the effects of the package environment (well almost not) as [...]

Just a quick post to let you know yours truly will be giving a presentation on:
Thermal Design: A Key Part of the Electronics Design Flow
At the UK Solutions Expo at the Heritage Motor Centre in Gaydon on 12th November.
Miniaturization continues to increase power densities at all packaging levels, forcing design teams to identify new methods [...]

The simplest of compact thermal models (CTMs) is a one resistor type. Of these the most widely quoted is Theta_ja (ok, ok, and Theta_jma, more on that variant later). Knowing the power dissipation of the component as well as the ambient temperature is in theory all that is required to determine the junction temperature from [...]