February, 2010

International Conference on High Temperature Electronics (HiTEC 2010)

February 26th, 2010

May 11-13, Hyatt Regency, Albuquerque, N.M. HiTEC 2010 provides a comprehensive technical program addressing the applications, and the latest development in devices, circuits, MEMS, sensors, packaging, power sources, and materials to address the challenges of…read more

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Single Fan Controller Improves Thermal Monitoring

February 26th, 2010

Degree Controls has released a single fan controller for improving thermal monitoring and fan speed management in electronic equipment. The TC10257 is small form factor, RoHS compliant, DC fan controller with reprogrammable interface. It is intended for…read more

Posted in Blowers / Fans / Filters, New Products | No Comments »

Solution for Semiconductor Package Thermal Design

February 26th, 2010

Mentor Graphics Corporation has announced the FloTHERM IC productivity tool targeting the semiconductor industry for thermal characterization and design. Addressing increased complexity, chip density, and high-speed requirements for today’s silicon designs, the FloTHERM IC solution…read more

Posted in New Products, Semiconductor | No Comments »

Natural Convection Cooling, Expanded I/O Packed into Rugged Control Unit

February 26th, 2010

Aitech Defense Systems Inc. now offers the NightHawk RCU, a rugged, compact Intel Atom-based, self-contained control unit that weighs only 4.5 pounds. The weight reduction, combined with a slim profile and natural convection/radiation cooling that…read more

Posted in Aerospace, Defense, New Products | No Comments »

Handbook Provides Tutorial for Thermoelectric Module Operation

February 26th, 2010

Laird Technologies, Inc. has released its revised “Thermoelectric Handbook.” Available for download from the Laird website, the handbook provides insight into understanding the basic structure and function of TEMs, parameters required for device selection, assembly…read more

Posted in News, TECs | 1 Comment »

Laser Cooling Demonstrated for TO-Can Packages

February 26th, 2010

Nextreme Thermal Solutions has demonstrated the cooling of a laser diode in a TO-8 package using an embedded thin-film thermoelectric OptoCooler HV14 module. Cooling the laser improves the output performance and reliability of the device.…read more

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Semiconductor Package Thermal Characterization and Design

February 24th, 2010

Mentor Graphics is offering a new web-based tool for thermal characterization and design of semiconductor packages. FloTHERM® IC reduces the time spent on thermal characterization and design by providing an automated process that includes pre-verified…read more

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NEW ElectronicsCooling Magazine Website

February 19th, 2010

Just a very quick post to alert you to the new ElectronicsCooling Magazine web site.  We’ve updated the look of the site to improve navigation ahead of the relaunch of the printed magazine. Here’s just some of the features of the new site:

New look and feel
Search
Improved Article and Content Navigation by author; category (Calculation Corner, New [...]

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Liquid Cooling – Are We There Yet?

February 15th, 2010

Back in June I posted ‘Air – Is it Running Out of Gas?’ and put forward the view that for general computing applications air isn’t running out of gas just yet. There are a couple of reasons for that.
One is that I suspect the general public has concerns about leaks. Most people have passed cars [...]

Posted in CFD Software, Design, Featured Blog, Liquid Cooling, Mentor Graphics Blog | No Comments »

Foresight and X-Ray Vision or Hindsight and Regret?

February 9th, 2010

I was on a conference call and WebEx yesterday with the NAFEMS CFD Working Group, of which Mentor Graphics is a member. One of the people on the call had a lot of background noise on his phone, which turned out to be a due to a fan by his desk to keep his computer [...]

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FREE Exhibition at SEMI-THERM, Santa Clara February 23-24

February 3rd, 2010

I’m off to SEMI-THERM later this month. SEMI-THERM is one of the premier thermal management conferences and has the best exhibition by far.
The conference runs from 21-25 February, the first two days of which are devoted to professional short courses delivered by a number of leading names in electronics cooling, and past recipients of the [...]

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