Coolcentric™, a new division of Vette Corp.®, offers patented LiquiCool® technology in a variety of turnkey data center cooling system solutions that can reduce cooling unit energy consumption by up to 90 percent and lower…read more
Universal liquid cooling system for graphics cards
March 30th, 2010
CoolIT’s OMNI ALC is a universal liquid cooling system for graphics cards. The OMNI’s water block is compatible with a wide range of video cards by simply swapping out a low-cost customized interposer plate. Alleviating…read more
Firms partner for manufacture of SynJet thermal management solutions
March 30th, 2010
Nuventix, Inc., innovator of SynJet® active thermal management solutions, has signed a Manufacturing Services Agreement with Nypro Inc., which provides plastic injection molding and turn-key assembly of Nuventix products. Under the terms of the agreement,…read more
Company to validate next-generation cooling system for aircraft avionics with Air Force
March 30th, 2010
Fairchild Controls Corporation, an EADS North America company, has signed a teaming agreement with the U.S. Air Force Research Laboratory (AFRL) to evaluate innovative cooling system technologies for avionics and mission systems aboard military aircraft.…read more
3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges
March 30th, 2010
A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states that the number of transistors that can be placed inexpensively…read more
Department of Energy announces $100 million for innovative research projects
March 30th, 2010
At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate innovation in green technology, increase America’s competitiveness and create new…read more
Sticking Plaster and Light beats Skin Cancer
March 24th, 2010
Thermal management of LEDs (Light Emitting Diodes) is an important application for CFD software, which is helping designers use LEDs for high-power lighting applications. However, LEDs are changing our lives in so many more ways than simply providing more energy efficient or more aesthetic lighting solutions.
Last year I posted about a light therapy device that [...]
IBM Work to take Moore’s Law to 2025
March 20th, 2010
It was very interesting to read this article about the work IBM are undertaking together with École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH) on a 3D stacked architecture for multiple cores. The four year collaborative project, called CMOSAIC, promises to deliver an interconnection density from 100 to [...]
Roundup of SEMI-THERM, FloTHERM IC launch and JEDEC
March 9th, 2010
I’m just back from a very productive SEMI-THERM Conference where we launched our new FloTHERM IC product. We had meetings with the editors of 5 leading electronics magazines to coincide with the launch, which was made at our vendor presentation during the exhibition at the start of Tuesday afternoon. Well done to all involved! If [...]
IC package representation is central to Electronics Cooling
March 4th, 2010
Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical related failure increases dramatically. The accuracy of any electronics thermal simulation will be determined by how well the IC package is represented in the solution. These are simple and evident truths. As the leading supplier [...]
Recent Posts
- Bottlenecks and Interface Materials; Part 2 – When TIMs Go Bad
- Has Your Brand Image Been Hijacked?
- Bridging the Simulation Supply Chain; NXP Semiconductors, a Case in Point
- Bottlenecks and Interface Materials; Part 1 – Great Thermal Bedfellows
- Mersen Acquires Laminated Busbar Company
- Coolers Utilize Aerospace Fluid-Bearing Technology
- Company Launches YouTube Channel for Engineers
- 40 GHz Bandwidth Socket for 16x16mm, 0.8mm Pitch BGA Packages
Latest Issue
Don’t miss out on
the December 2011 issue
of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Heat pipes for electronics cooling applications 6 comment(s)
- Notes on using thermocouples 4 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- All you need to know about fans 1 comment(s)
- ElectronicsCooling September 2011 Issue 0 comment(s)
- Company launches new energy efficiency center - read more - http://t.co/8pEdpS47 #
- Wireless shortcut avoids data center traffic jams - read more - http://t.co/4qh2RvIH #
- Lighting-class LEDs deliver twice the lumens-per-dollar - read more - http://t.co/QAypwTaz #
- The special TIMs issue of the eNewsletter will be delivered in 2 weeks. Subscribe today to receive your free copy! - http://t.co/uagtDzM7 #
