March, 2010

Data center cooling solutions cut energy consumption and costs

March 30th, 2010

Coolcentric™, a new division of Vette Corp.®, offers patented LiquiCool® technology in a variety of turnkey data center cooling system solutions that can reduce cooling…read more

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Universal liquid cooling system for graphics cards

March 30th, 2010

CoolIT’s  OMNI ALC is a universal liquid cooling system for graphics cards. The OMNI’s water block is compatible with a wide range of video cards…read more

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Firms partner for manufacture of SynJet thermal management solutions

March 30th, 2010

Nuventix, Inc., innovator of SynJet® active thermal management solutions, has signed a Manufacturing Services Agreement with Nypro Inc., which provides plastic injection molding and turn-key…read more

Posted in Applications, Materials, Compounds, Adhesives, Substrates, News | No Comments »

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Company to validate next-generation cooling system for aircraft avionics with Air Force

March 30th, 2010

Fairchild Controls Corporation, an EADS North America company, has signed a teaming agreement with the U.S. Air Force Research Laboratory (AFRL) to evaluate innovative cooling…read more

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3D chip stacking to take Moore’s Law past 2020, pose new chip cooling challenges

March 30th, 2010

A team of IBM Researchers in collaboration with two Swiss partners are looking to keep “Moore’s Law” alive for another 15 years. The law states…read more

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Department of Energy announces $100 million for innovative research projects

March 30th, 2010

At the inaugural ARPA-E Energy Innovation Summit, U.S. Energy Secretary Steven Chu announced $100 million in Recovery Act funding will be made available to accelerate…read more

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Sticking Plaster and Light beats Skin Cancer

March 24th, 2010

Thermal management of LEDs (Light Emitting Diodes) is an important application for CFD software, which is helping designers use LEDs for high-power lighting applications. However, LEDs are changing our lives in so many more ways than simply providing more energy efficient or more aesthetic lighting solutions.
Last year I posted about a light therapy device that [...]

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IBM Work to take Moore’s Law to 2025

March 20th, 2010

It was very interesting to read this article about the work IBM are undertaking together with École Polytechnique Fédérale de Lausanne (EPFL) and the Swiss Federal Institute of Technology Zurich (ETH) on a 3D stacked architecture for multiple cores. The four year collaborative project, called CMOSAIC, promises to deliver an interconnection density from 100 to [...]

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Roundup of SEMI-THERM, FloTHERM IC launch and JEDEC

March 9th, 2010

I’m just back from a very productive SEMI-THERM Conference where we launched our new FloTHERM IC product. We had meetings with the editors of 5 leading electronics magazines to coincide with the launch, which was made at our vendor presentation during the exhibition at the start of Tuesday afternoon. Well done to all involved! If [...]

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IC package representation is central to Electronics Cooling

March 4th, 2010

Electronics cooling involves ensuring that IC package temperatures do not exceed maximum rated values. If they do the probability of thermo-mechanical related failure increases dramatically. The accuracy of any electronics thermal simulation will be determined by how well the IC package is represented in the solution. These are simple and evident truths. As the leading supplier [...]

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