Did you miss us? For those of you that are faithful readers of Electronics Cooling, we are pleased to inform you that after a short interval of restructuring, we have resumed publication. Given the recent downturn in…read more
thermal facts and fairy tales: most of us live neither in wind tunnels nor in the world of Nusselt
April 30th, 2010
Having read myriad papers/articles/books/reports on thermal management, I feel there is a lot of misunderstanding about what really should drive a sound approach of how to tackle the thermal problems that tend to land on…read more
integrating vapor chambers into thermal solutions
April 30th, 2010
Introduction Often in high power density or low profile heat sink applications, the spreading resistances in the base of the heat sink limits the performance of the design. Once it is determined that…read more
electronics cooling in the automotive environment
April 30th, 2010
Introduction By 2008 the electronics content of a typical consumer vehicle had grown to 20-25% of the total vehicle cost [1]. This content provides a wide range of functions and features for today’s driver. Some…read more
carbon nanotubes as high performance thermal interface materials
April 30th, 2010
Introduction Because of substantial increases in the power density of electronic packages over the past few decades, thermal interface resistance can comprise more than 50% of the total thermal resistance in current high-power packages [1].…read more
a case study to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications
April 30th, 2010
Introduction Small-channel heat sinks provide an extremely compact and efficient vehicle for dissipation of large heat fluxes typically found in high power electronics. Fluid flow and heat transfer in small-sized channels, with hydraulic diameters on…read more
Miniature Environmental Control Unit for Electronics
April 27th, 2010
Aspen Systems has completed the development and military qualification of ECU-Chill™, a ruggedized refrigeration-based environmental control unit (ECU) for cooling electronics in mobile applications. ECU-Chill™ maintains sealed electronics enclosures at or below ambient temperatures, enabling Commercial-Off-The-Shelf…read more
Thermally Conductive Printed Circuit Board Substrate
April 27th, 2010
Laird Technologies, Inc. recently announced the release of its enhanced Tlam™ SS LLD for use as a thermally conductive printed circuit board (PCB) substrate. The Tlam SS LLD is a versatile, thermally enhanced PCB substrate…read more
Evaluation Method for Thermoelectrical Cooling Systems
April 27th, 2010
IEC/TS 62610-3 ed1.0 — Mechanical structures for electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series – Part 3: Design guide: Evaluation method for thermoelectrical cooling systems (Peltier…read more
Chicago Data Center Project Moves Ahead
April 27th, 2010
Plans for a 315,000 square-foot data center facility on Chicago’s Near South Side are moving forward, with city approval clearing the way for design and construction. The development team has set a goal of fall…read more
Researchers Cool Down Supercomputers with Warm Water
April 27th, 2010
A team of IBM researchers in Switzerland is experimenting with a micro network of copper tubes that run through smaller, clustered computer servers and whisk away heat with the help of warm water. Liquid cooling,…read more
Company Unveils Eyepiece for Thermal Imaging Applications
April 26th, 2010
Kopin® Corporation recently launched a new family of complete plug-and-play eyepiece products for thermal imaging applications at the Defense, Security, and Sensing 2010 Symposium in Orlando, Fla. Kopin introduced standard and custom eyepiece solutions based…read more
The Debate about Liquid Cooled Data Centers
April 19th, 2010
I’ve been remiss in not posting for a couple of weeks, so I’m trying to get back in the saddle. I’ve been working on other things that have taken up a fair bit of time. One is a web seminar on heatsinks – Heatsink 201 – Even More about Heat Sinks which follows on from [...]
IC Package Thermal Characterization Made Easy
April 13th, 2010
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and…read more
Recent Posts
- Bottlenecks and Interface Materials; Part 2 – When TIMs Go Bad
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- Mersen Acquires Laminated Busbar Company
- Coolers Utilize Aerospace Fluid-Bearing Technology
- Company Launches YouTube Channel for Engineers
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