Silent-cooled graphics cards are becoming increasingly prevalent as PC hardware is becoming increasingly efficient. In silent cooling, a heat sink is installed in a model that engineers determine can remain safely cool without a fan.…read more
ElectronicsCooling Summer 2010 Print Issue
July 27th, 2010
Don’t miss out on the Summer 2010 issue of ElectronicsCooling, which includes feature articles on thermal design in silicon validation platforms, motor supports and small scale fans, and solar photovoltaic cell thermal measurements. If you…read more
An Interview With… Clemens Lasance
July 27th, 2010
Every industry or industry sub-sector has its movers and shakers, its pioneers and thought leaders. These people have likely helped shape and evolve that industry to what it is today and what it may become in the future. For this series of ‘An Interview With…’ blog posts I will be posing the same set of questions [...]
Product Line for Cooling Applications Requiring Fan Guards
July 26th, 2010
Orion Fans now offers a complete line of wire mesh, plastic, louvered, push-on, metal and filtered fan guards and kits, providing design engineers multiple guard options when evaluating fans for their specific applications. Whether the…read more
New Instrument System Enables Precise Air Flow
July 26th, 2010
Advanced Thermal Solutions, Inc. (ATS) has introduced the iTHERM-100 Test Station, a turnkey system of laboratory instruments and sensors for studies that require precise air flow velocity and temperature measurement. Applications include thermal management studies…read more
Company Expands Services to Solve Thermal Management Issues
July 26th, 2010
Nextreme Thermal Solutions has announced the expansion of its services offerings to include materials evaluation and characterization services. Equipped with a full range of thermal modeling, design and engineering consulting services, Nextreme’s team of engineers…read more
LED Cooling Solutions Now Available from New Distributor
July 26th, 2010
Nuventix, Inc., developer of SynJet® thermal management solutions for LED luminaires, recently announced a distribution agreement making the company’s LED cooling products available from LED lighting component and support services provider Future Lighting Solutions. The…read more
Series of Papers Illustrate Use of Thermal Simulation Technology in Design
July 26th, 2010
NMB Technologies Corporation introduces a new series of informational engineering papers on how thermal simulation can aid, not only in the design of a system, but in anticipating the behavior of cooling components. In looking…read more
Nanowick at Heart of New System To Cool ‘Power Electronics’
July 26th, 2010
Researchers have shown that an advanced cooling technology being developed for high-power electronics in military and automotive systems is capable of handling roughly 10 times the heat generated by conventional computer chips, according to a…read more
Hybrid’s Liquid System Allows Chevy to Offer Cool Warranty
July 26th, 2010
The liquid heating and cooling system in the Chevrolet Volt battery not only enabled General Motors Co. to offer a long warranty of eight years or 100,000 miles, but it also gave engineers more room…read more
The Uses of Simplicity in Thermal Analysis
July 26th, 2010
Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system…read more
Calculation Corner: Using Vendor Data to Estimate Thermoelectric Module Cooling Performance in An Application Environment
July 26th, 2010
The application of thermoelectric devices to cool electronic components has been of interest to thermal engineers for many years. Thermoelectric (TE) cooling modules offer the potential to either reduce component operating temperatures at a given…read more
Thermal Facts and Fairy Tales: Uncertainty is Assured
July 26th, 2010
Do you know the thermal conductivity of paper? This was the start of a phone call a few years ago. The conversation continued and the reason for the question became apparent. A thermal analysis of…read more
Experimental Methodologies for Thermal Design in Silicon Validation Platforms
July 26th, 2010
Rahima K. Mohammed, Yi Xia, Ying-Feng Pang, Ridvan A. Sahan Intel® Corporation Introduction Silicon validation platforms are purpose-built to validate processors, chipsets, and ASICs to ensure world-class quality and reliable products. These platforms are a…read more
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