2011

Self-Healing Electronics Could Work Longer, Reduce Waste

December 22nd, 2011

A team of University of Illinois engineers has developed a self-healing system that restores electrical conductivity to a cracked circuit in less time than it takes to blink. Led by aerospace engineering professor Scott White and materials science and engineering professor Nancy…read more

IBM Retiree Wins Award from Engineers Society

December 22nd, 2011

Robert E. Simons was named the 2011 winner of the Allan D. Kraus Thermal Management Medal given recently by the committee that manages the annual award for the American Society of Mechanical Engineers. Simons is…read more

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Editorial: Looking Back

December 22nd, 2011

In the editorial in the fall issue of ElectronicsCooling, my good friend and colleague Clemens Lasance wrote, “It is the privilege of an editor to discuss any subject that comes to mind, as long as…read more

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Thermal Facts and Fairy Tales: Heat Sinks, Heat Exchangers and History

December 22nd, 2011

As far as history goes, the field of electronics cooling does not have a very long past. A rather quick look through my personal reference material that is strictly geared towards cooling electronics had at…read more

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New Capacitors with Low Insertion Height

December 22nd, 2011

TDK-EPC has developed a wide range of EPCOS MKP and MKT film capacitors with low insertion heights. The new capacitors with a lead spacing of 37.5 mm feature insertion heights of only 15 or 19 mm. These components…read more

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Precision High Voltage Modules

December 22nd, 2011

Spellman High Voltage Electronics Corporation’s new V6 high precision, cost-effective high voltage modules on a common platform include either AC or DC input, with analog or digital interface (RS232) capabilities. The V6 Series offers output…read more

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Technical Brief: Design Considerations for High Performance Processor Liquid Cooled Cold Plates

December 22nd, 2011

The meteoric rise in cooling requirements of commercial computer products has been driven by an exponential increase in microprocessor performance over the last decade. The conventional way to cool microprocessors has been to utilize air…read more

Thermal Modeling and Testing for LEDs and Luminaires

December 22nd, 2011

Mentor Graphics Corp. has introduced the T3Ster (“trister”) thermal transient tester for LEDs, board-level LED arrays and luminaires. Together with the company’s FloTHERM thermal simulation tool based on computational flow dynamics (CFD), lighting designers can…read more

New Law Focuses on Rare Metals in Electronics

December 22nd, 2011

A provision on “conflict minerals” that was slipped into a 2010 financial reform law, the Dodd-Frank Act, will help educate American consumers on what is in their smart phones, computers and other electronics and where…read more

Tiny Solar Cell Saves Money and Energy

December 22nd, 2011

The U.S. Department of Energy’s National Renewable Energy Laboratory recently validated greater than 41 percent efficiency at a concentration of 1,000 suns for tiny cells made by Semprius. The energy conversion efficiency of a solar…read more

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Carbon Nanotubes as Conductive Material for Through-Silicon Vias

December 22nd, 2011

A research team at Chalmers is working with carbon nanotubes as conductive material for through-silicon vias. Carbon nanotubes are going to be the most reliable of all conductive materials if it is possible to use…read more

New Method for Enhancing Thermal Conductivity Could Cool Computer Chips

December 22nd, 2011

The surprising discovery of a new way to tune and enhance thermal conductivity gives engineers a new tool for managing thermal effects in smart phones and computers, lasers and a number of other powered devices.…read more

Calculation Corner: Transient Thermal Modeling of a High-Power IC Package, Part 1

December 22nd, 2011

Part II can be found here. There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater…read more

Efficient Electro-Thermal Simulation of Power Semiconductor Devices via Model Order Reduction

December 22nd, 2011

Thermal management is an increasingly important consideration in the development of power electronic systems. Electro-thermal simulation is required at the system level in order to ensure under realistic loads the fulfillment of thermal requirements, which…read more

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