Automobiles, military vehicles, even large-scale power generating facilities may someday operate far more efficiently thanks to a new alloy developed at the U.S. Department of Energy’s Ames Laboratory. A team of researchers at the Lab…read more
SEMI-THERM 27
February 22nd, 2011
March 20-24, San Jose, Calif. SEMI-THERM is an international forum dedicated to the thermal design and characterization of electronic components and systems. The symposium fosters the exchange of knowledge between practitioners and leading experts from…read more
Cooling Fans Work Harder when Contamination Accumulates on Circuit Boards
February 22nd, 2011
Contamination accumulated on electronic circuit boards will cause temperatures in electronics to rise, triggering cooling fans to work harder to keep the equipment below its operating temperature limit, according to a new research paper by…read more
Little Layer Cakes of Crystal Could Help Shrink Computers
February 22nd, 2011
In research aimed at making computers even smaller and more powerful, two engineers at Duke University have made headway in the quest to control the beams of light generated by tiny lasers. The two Duke…read more
Report Reviews Thermal Interface Material Market
February 21st, 2011
A report from marketing research company Japan Marketing Survey (JMS), “Outlook of Thermal Interface Material Market 2010,” offers data on the thermal interface material market and thermal filler market. The report is organized by market…read more
‘What is the Future of the Data Center?’
February 21st, 2011
April 7, Newark, N.J. This New York data center discussion panel event and reception delivers tactics and strategies to address the hottest issues: next-stage virtualization, the impact of cloud computing, best practices in cost optimization,…read more
EC Plug Fans Provide Energy Efficient Precision Cooling
February 21st, 2011
In response to the increasing needs for data center and IT managers to both reduce costs and increase availability, Emerson Network Power, a business of Emerson (NYSE: EMR) and the global leader in enabling Business-Critical…read more
New Book on Thermal Computations for Electronics
February 21st, 2011
Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling by Gordon Ellison is a total revision of his previous work on the subject. This text helps readers understand and master mathematical calculation, prediction and…read more
Sensor Film Monitors Surface Temperature Variations in Heat Sinks
February 21st, 2011
Thermex® is a thin sensor film that can be used in multiple applications to test and monitor heated contacting surfaces from 200° to 300°F (93° to 149°C). Upon exposure to heat, Thermex® changes color instantaneously…read more
Thermal Gap Filler Wins Editor’s Choice Award
February 21st, 2011
The Tflex™ XS400 Series thermal gap filler won Military Embedded Systems Magazine’s Editor’s Choice award for November/December. The Tflex™ XS400 Series received the award for its commercial, off-the-shelf (COTS) properties, which makes it well-suited for…read more
LED Controller with Active PFC Needs No Opto-Coupler
February 21st, 2011
New isolated LED controller with active power factor correction (PFC) is specifically designed for driving LEDs from a universal input range of 90VAC to 265 VAC. The LT3799 is cost efficient and more reliable because…read more
Energy Management Software Helps Data Centers Conserve Energy
February 21st, 2011
Power IQ 2.0 Energy Management software provides Thermal Analytics for monitoring rack temperatures based on industry guidelines. Trending reports and cumulative totals can be displayed at the data center, floor, room, rack, customer and IT…read more
Rugged Fan Controllers for Chassis Management
February 21st, 2011
Curtiss-Wright Controls Electronic Systems has released its new family of Hybricon rugged intelligent fan controllers for chassis management. These MIL-STD-461F, MIL-STD-810G and MIL-STD-704F fan controllers provide intelligent nodes for use in PMBus-based chassis management systems,…read more
Beer Fridge – A Case Study in Thermal Design. Part 6 – Baffles and Bottlenecks
February 14th, 2011
For a blog series focused on thermal design there has been precious little design presented so far. Design is the process of making a plan for the construction of an object/product. Whether you subscribe to the rational or action-centric model of the design process, some form of iteration and adaption is used to arrive at [...]
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