Test & Measurement

New Thermal Testing Standard

April 8th, 2011


JEDEC has approved a thermal transient testing-based measurement methodology inspired by an original idea published jointly by Mentor Graphics Corporation’s MicReD® group and the Automotive Power Application group of Infineon in 2005. This newly published JESD51-14 standard is titled “Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-case of Semiconductor Devices with Heat Flow through a Single Path.” The methodology used in this new standard is very similar to the method which can also be used to characterize thermal interface materials (TIMs).

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