New Thermal Testing Standard

JEDEC has approved a thermal transient testing-based measurement methodology inspired by an original idea published jointly by Mentor Graphics Corporation’s MicReD® group and the Automotive Power Application group of Infineon in 2005. This newly published JESD51-14 standard is titled “Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-case of Semiconductor Devices with Heat Flow through a Single Path.” The methodology used in this new standard is very similar to the method which can also be used to characterize thermal interface materials (TIMs).

Learn more from Mentor.

Comment