July, 2011

Range of Wall Rack Systems Designed for Fast Installation

July 22nd, 2011

METCASE’s new RETEX EASYRACK range of 19” wall mount racks are designed for fast installation of network cabling and electronics equipment, in data centers, office or home office applications. EASYRACK cabinets conform to IEC 60…read more

Storage Solution Freezer Features New Energy Saving Heat Exchanger

July 22nd, 2011

SANYO’s new low temperature freezer, the MDF-U76VC, offers an advanced combination of cabinet design, electronics and refrigeration. A new heat exchanger design allows greater energy savings and efficiency. The design maximizes the surface area for…read more

Training Module Examines Thermoelectric Module Product Line

July 22nd, 2011

Laird Technologies, Inc. has added its Thermoelectric Module (TEM) product line to Digi-Key’s Product Training Modules OnlineOn Demand (PTM)® series. This module is available for download in audio and non-audio formats from the Digi-Key Website.…read more

Plasma System for Low-Cost, High Performance Wafer Processing

July 22nd, 2011

Nordson MARCH’s new FlexTRAK™-WF plasma treatment system is a cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over. An integrated robot and aligner automate the processing of a wide variety…read more

Multi-GPU Accelerated Wing Tip Vortex Extraction Using Avizo Framework

July 22nd, 2011

This paper presents a scientific visualization framework where strong vortical flow features, commonly appearing in turbulent flow, are extracted to support parameterization, automation and interactive exploration of CFD solutions. Tip vortex near an aerodynamic wing…read more

Standard Test Method for Pressure Calibration of Thermal Analyzers

July 22nd, 2011

This test method, ASTM E2744-10, describes the calibration or performance confirmation of the electronic pressure signals from thermal analysis apparatus. The values stated in SI units are to be regarded as standard. No other units…read more

Companies Sign Agreement for Joint Strike Fighter Enclosures

July 22nd, 2011

Harris Corporation has signed a long term agreement with TAE for the manufacture and supply of advanced liquid cooled electronics enclosures for the F-35 Joint Strike Fighter (JSF).  The key to the deal was TAE’s…read more

GE Invests in LED Cooling Technology Creator

July 22nd, 2011

GE has provided capital and entered into a license agreement to access Nuventix’s patent portfolio. Nuventix developed a method for moving air to cool LEDs using a single oscillating membrane, called a SynJet®, as an…read more

University Receives Grant for Silicon-Based Technologies Research

July 22nd, 2011

The University of Warwick Department of Physics has been awarded a five-year £1.7 million grant for “Creating Silicon Based Platforms for New Technologies.” The initiative will bring in new technologies ranging from energy harvesting to…read more

College Physics Department Researching Quantum Nature of Atoms

July 22nd, 2011

A group led by Seth Aubin, assistant professor of physics at William & Mary, is putting finishing touches on an apparatus that will chill atoms to near absolute zero. At these low temperatures, the quantum…read more

Wire Grid Cools Light Emitting Diodes

July 22nd, 2011

Ventiva has come up with a wire grid that effectively cools light emitting diodes, solid state lights and other electronic components in a way that can be considered both active and passive. A small charge…read more

Invention Speeds Solar Cell Quality Tests

July 22nd, 2011

Three scientists from the U.S. Department of Energy’s National Renewable Energy Laboratory have developed a way to assess the quality of solar cells at a speed that is orders of magnitude faster than had been…read more

Workcell for Automated Film-Frame Wafer Dispensing Applications

July 11th, 2011

Nordson ASYMTEK’s new automated workcell for film-frame wafer-level packaging applications, MH-910W, is designed for 150-mm film-frame wafer processing and is flexible enough to support various sizes. Applications include MEMs/image sensor capping, wafer coating for imaging…read more

New Range of Energy Saving Refrigerant Dryers

July 11th, 2011

BOGE America Inc.’s new RA series refrigerant dryers reduce pressure losses and low energy consumption. The new RA 10 to RA 5000 series refrigerant dryers utilizes time proven and field tested components, including a specially-designed…read more