2012

New Thermal Management “Centers of Excellence” Optimal for Heat Sink Production

December 31st, 2012

Thermal management solutions company Sapa Extrusions North America has created two thermal management “centers of excellence” at the company’s Mountain Top, Pa. and City of Industry, Calif. locations. According to the company, the “center of…read more

U.S. DoD Plans to Implement Hot Water Liquid Cooling System into Major Data Center

December 31st, 2012

The U.S. Department of Defense (DoD) is planning to implement a liquid cooling systems into one of its major data centers. Developed by liquid cooling solutions company Asetek Inc., the direct-to-chip liquid cooling technology employs…read more

Ultrathin “Nanoglue” Increases Heat Transfer Rate Across Metal-Ceramic Interface

December 31st, 2012

Researchers at the Rensselaer Polytechnic Institute (RPI) in New York have developed a new method for increasing the heat transfer rate across two different materials. The team hopes that the study, titled “Bonding-Induced Thermal Conductance…read more

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Editorial: An Exciting Time for Thermal Engineers

December 19th, 2012

I am delighted to have the opportunity to write this editorial and follow in the footsteps of my illustrious colleagues at ElectronicsCooling, both past and present.  In keeping with tradition, I would like to share…read more

Thermal Facts and Fairy Tales: Not Always Efficient

December 19th, 2012

Reducing the power required to cool electronics has significant cost advantages and quantifying the potential improvements of one technology over another is a frequent theme in current electronics cooling literature.  Developing life cycle cost models…read more

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Application of Transient Thermal Methods to Moisture Diffusion Calculations, Part I

December 19th, 2012

Bruce Guenin, Assoc. Editor, Electronics Cooling View Part 2 here. Introduction Many of the components currently used in electronics systems employ organic materials.  Under certain circumstances, the diffusion of moisture into electronic components can lead…read more

8th European Advanced Technology Workshop on Micropackaging and Thermal Management

December 19th, 2012

February 6-7, 2013 La Rochelle, France IMAPS France will host the 8th annual European Advanced Technology Workshop on Micropackaging and Thermal Management on February 6-7, 2013 in La Rochelle, France. The workshop will feature a…read more

Thermal Characterization of Electronic Components and Systems

December 19th, 2012

February 6, 2013 Frankfurt, Germany Mentor Graphics is hosting a seminar on the thermal characterization of electronic components and systems on February 6, 2013 in Frankfurt Germany. Attendees will learn about the T3Ster Thermal Transient…read more

Consumer Electronics Show 2013

December 19th, 2012

January 8-11, 2013 Las Vegas, Nevada The 2013 International Consumer Electronics Show is a major technology-related trade show to be held January 8-11, 2013 in Las Vegas, Nevada. Attendees will have the chance to view…read more

Research Strengthens Knowledge of Electron Cooling Behavior in Graphene

December 19th, 2012

A research team supported by the Kavli Institute at Cornell for Nanoscale Science has released the first known direct measurements of hot electrons cooling down in graphene, in an effort to answer questions about the…read more

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Electronics Cooling December Issue Now Online

December 19th, 2012

Don’t miss out on the December 2012  issue of Electronics Cooling, which includes  feature articles on humidity excursions in Facebook’s Prinville Datacenter, use of synthetic jets, a history of ASHARE technical committee TC 9.9, and …read more

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Patent Granted for Aircraft Liquid Cooling Apparatus

December 19th, 2012

The United States Patent and Trademark Office has granted patent no. 8,315,053, titled “Aircraft Electronics Cooling Apparatus for an Aircraft Having a Liquid Cooling System,” to Airbus Operations GmbH. According to the abstract released by…read more

Direct Contact Liquid Cooling for the Datacenter – Can it be Simple, Low Cost, High Performance and Efficient?

December 18th, 2012

­­­In the mid 1960’s liquid cooling was deemed necessary by mainframe producers like IBM as the heat flux generated with bipolar circuit technology rose past levels that could be easily managed by traditional air cooling.…read more

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Evaluation and Opportunities for Use of Thin Form Factor Synthetic Jets to Low Profile Electronics Cooling Applications

December 18th, 2012

Introduction Modern portable consumer electronics devices such as ultrabooks, tablets and smartphones are easily recognized for the incredible functionality they offer in very compact packages. Due to advances in semiconductor miniaturization and the development of…read more

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