Through a combination of atomic-scale materials design and ultrafast measurements, researchers at the University of Illinois have revealed new insights about how heat flows across an interface between two materials. The researchers demonstrated that a…read more
SEMICON West 2012
May 4th, 2012
July 10-12, Moscone Center, San Francisco, Calif. SEMICON West is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design…read more
Summer Heat Transfer Conference
May 4th, 2012
July 8-12, Puerto Rico This conference will bring together international researchers and engineers focusing on heat and mass transfer and fluid flow in a variety of applications. The objectives of the meeting are to provide…read more
IMS2012 International Microwave Symposium
May 4th, 2012
June 17-22, Montreal, Canada Join us in Montréal Canada to experience a record breaking year for the IEEE International Microwave Symposium (IMS). Celebrating the 60th anniversary of the Microwave Theory and Techniques Society (MTT-S) and…read more
Multi-Port Cages with Thermal Management
May 4th, 2012
dataMate™, a division of Methode Electronics, Inc.’s Data Solutions Group, announced the development of a patent pending SFP+ cage system with advanced thermal management features to prevent data error and hardware failure due to excessive…read more
55°C Cooling Performance Thin-Film Thermoelectric Coolers
May 4th, 2012
Nextreme Thermal Solutions has announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. The 55°C temperature milestone, known as the ΔTmax, reflects the…read more
A Little Goes A Long Way (But A Lot Doesn’t Go Much Further)
May 3rd, 2012
It has been almost 3 years since I started this blog and I hope you’ve found it as interesting as I have cathartic. Although I’m not as yet bereft of topic ideas, I thought this…read more
Significant Changes to the NFPA 70E Standard 2012 Edition
May 2nd, 2012
Mersen recently published a technical white paper on Standards and Codes: SCN4, Note 1, “Significant Changes to the NFPA 70E Standard 2012 Edition.” NFPA 70E is the standard for electrical safety in the workplace, and…read more
Company Expands North American Technical Sales Network
May 1st, 2012
Aligned Solutions, Inc will sell Rehm Thermal System’s Convection, Condensation, and Vacuum soldering products throughout the greater Midwest. Aligned Solutions offers a combination of veteran experience and a diverse range of equipment, materials and process…read more
Compact Point-and-Shoot Thermal Imager
April 30th, 2012
Omega introduces its new line of compact thermal imagers powered by FLIR®. The OSXL-I series (FLIR I Series) is a compact, lightweight, point-and-shoot camera with an easy-to-use focus-free lens. This CE compliant product stores up…read more
New IGBT Base Plate Technology
April 29th, 2012
Wolverine’s MicroCool® Division is proud to announce its global License Agreement with Infineon Technologies AG for the development, manufacture, and sale of its current MDT technology combined with existing clad metal material to create a…read more
X-Ray Diffraction Reveals 3D Mechanics of Germanium-Crystal Arrays
April 27th, 2012
Scientists at the European Synchrotron Radiation Facility (ESRF) are using X-ray diffraction to thoroughly understand a new type of nanostructure — square arrays of germanium (Ge) pillars that have very complex geometries and physical attributes.…read more
A Child’s Take on Electronics Cooling
April 26th, 2012
Today is National Take Your Kids To Work Day, and we had the opportunity to meet Elias Kilshaw. Watch the video to get his point of view on Electronics Cooling and Thermal Management.

