March, 2012

Top 5 Favorite Things about SEMI-THERM

March 29th, 2012

We just returned from SEMI-THERM 28 in San Jose, California, and we wanted to share with you our 5 favorite things about this year’s conference: #5: Attending Technical Sessions Six new technical short courses were…read more

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Thermally Conductive Compounds for Enhanced LED Luminaires

March 27th, 2012

Global custom engineered thermoplastics compounder RTP Company has introduced a line of thermally conductive compounds for replacing metal heat sinks and housings in light-emitting diode (LED) luminaires.  The new compounds have been specially formulated to…read more

EuroSime 2012

March 26th, 2012

April 16-18, Lisbon, Portugal 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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Enclosure Models Meet European ATEX Directive

March 26th, 2012

Pentair Technical Products announces a fully featured, expanded line of Hoffman™ brand ZONEX™ ATEX-Certified* Enclosures. ZONEX hinge-cover and screw-cover enclosures are designed for use in applications where “increased safety” protection (Ex e), as defined by…read more

3D Fluid-Flow Analysis Software

March 26th, 2012

TriStar increases its expertise in the CAD design market by taking part in the area of pre-physical prototype production. The Mentor Graphics® FloEFD™ product is a full-feature 3D fluid-flow analysis package that enables engineers to…read more

Lithium-Ion Battery Option for DIN Rail Industrial UPS

March 26th, 2012

A lithium-ion-based battery is now available for Phoenix Contact’s Quint UPS-IQ line. The new battery’s longer lifespan and extended temperature range minimize the need for frequent battery replacement. The lithium technology has a lifespan of…read more

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Heat Sink for Packing Densities up to 100W/cm2

March 26th, 2012

Ceramtec’s CeramCool Box is made for homogeneous and efficient cooling of packing densities up to 100W/cm2. For example, with an edge length of just 16 x 40 x 40 mm it has a total cooling…read more

Thermal Solutions Company Earns AS9100 Rev. C Certification

March 26th, 2012

Thermacore, Inc. has achieved AS9100:2009 Rev. C certification and was re-certified to ISO 9001:2008. AS9100 Rev. C imposes a number of requirements for the business process that must be fulfilled to achieve customer satisfaction, including…read more

Apple’s New iPad Has Heat Problems

March 26th, 2012

Heat-related issues may already be plaguing Apple’s new third-generation iPad. According to tests conducted by Consumer Reports, the new third-generation iPad measured approximately 12 to 13 degrees Fahrenheit warmer than the second-generation iPad. Consumers have…read more

Diamond-Thin Films Cool Electronics

March 26th, 2012

Two new studies performed at the U.S. Department of Energy’s Argonne National Laboratory have revealed a new pathway for materials scientists to use previously unexplored properties of nanocrystalline-diamond thin films. The unusually attractive thermal properties…read more

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Slim Form Factor Liquid Cooling for Laptops and All-In-Ones

March 26th, 2012

Asetek Inc. announced today a new slim form factor liquid cooling technology for extreme performance and workstation grade laptops and All-In-One PCs. The fundamental challenge in cooling desktop replacement laptops and All-In-One PCs is the…read more

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Company Demonstrates Thermal Cooling Jet Technology

March 21st, 2012

GE Global Research presented its advanced, dual piezoelectric, thermal cooling jet (DCJ) during a vendor workshop at SEMI-THERM 28. The DCJ, a 1 mm thick, ultra-compact bellows device provides air flow more efficiently than a…read more

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Interview with SEMI-THERM Founder, Bernie Siegal

March 21st, 2012

Bernie Siegal, the founder of SEMI-THERM, gives a snapshot of the history of the symposium, the current event and the future of SEMI-THERM.

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David Copeland Welcomes You to “The Heat is On” by MEPTEC

March 21st, 2012

Conference chair speaks about “The Heat is On,” a mini-conference of SEMI-THERM 28, which deals in the thermal management and packaging of electronic products and devices. The theme was evolutionary and revolutionary trends in the…read more

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