We just returned from SEMI-THERM 28 in San Jose, California, and we wanted to share with you our 5 favorite things about this year’s conference: #5: Attending Technical Sessions Six new technical short courses were…read more
Thermally Conductive Compounds for Enhanced LED Luminaires
March 27th, 2012
Global custom engineered thermoplastics compounder RTP Company has introduced a line of thermally conductive compounds for replacing metal heat sinks and housings in light-emitting diode (LED) luminaires. The new compounds have been specially formulated to…read more
EuroSime 2012
March 26th, 2012
April 16-18, Lisbon, Portugal 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Enclosure Models Meet European ATEX Directive
March 26th, 2012
Pentair Technical Products announces a fully featured, expanded line of Hoffman™ brand ZONEX™ ATEX-Certified* Enclosures. ZONEX hinge-cover and screw-cover enclosures are designed for use in applications where “increased safety” protection (Ex e), as defined by…read more
3D Fluid-Flow Analysis Software
March 26th, 2012
TriStar increases its expertise in the CAD design market by taking part in the area of pre-physical prototype production. The Mentor Graphics® FloEFD™ product is a full-feature 3D fluid-flow analysis package that enables engineers to…read more
Lithium-Ion Battery Option for DIN Rail Industrial UPS
March 26th, 2012
A lithium-ion-based battery is now available for Phoenix Contact’s Quint UPS-IQ line. The new battery’s longer lifespan and extended temperature range minimize the need for frequent battery replacement. The lithium technology has a lifespan of…read more
Heat Sink for Packing Densities up to 100W/cm2
March 26th, 2012
Ceramtec’s CeramCool Box is made for homogeneous and efficient cooling of packing densities up to 100W/cm2. For example, with an edge length of just 16 x 40 x 40 mm it has a total cooling…read more
Thermal Solutions Company Earns AS9100 Rev. C Certification
March 26th, 2012
Thermacore, Inc. has achieved AS9100:2009 Rev. C certification and was re-certified to ISO 9001:2008. AS9100 Rev. C imposes a number of requirements for the business process that must be fulfilled to achieve customer satisfaction, including…read more
Apple’s New iPad Has Heat Problems
March 26th, 2012
Heat-related issues may already be plaguing Apple’s new third-generation iPad. According to tests conducted by Consumer Reports, the new third-generation iPad measured approximately 12 to 13 degrees Fahrenheit warmer than the second-generation iPad. Consumers have…read more
Diamond-Thin Films Cool Electronics
March 26th, 2012
Two new studies performed at the U.S. Department of Energy’s Argonne National Laboratory have revealed a new pathway for materials scientists to use previously unexplored properties of nanocrystalline-diamond thin films. The unusually attractive thermal properties…read more
Slim Form Factor Liquid Cooling for Laptops and All-In-Ones
March 26th, 2012
Asetek Inc. announced today a new slim form factor liquid cooling technology for extreme performance and workstation grade laptops and All-In-One PCs. The fundamental challenge in cooling desktop replacement laptops and All-In-One PCs is the…read more
Company Demonstrates Thermal Cooling Jet Technology
March 21st, 2012
GE Global Research presented its advanced, dual piezoelectric, thermal cooling jet (DCJ) during a vendor workshop at SEMI-THERM 28. The DCJ, a 1 mm thick, ultra-compact bellows device provides air flow more efficiently than a…read more
Interview with SEMI-THERM Founder, Bernie Siegal
March 21st, 2012
Bernie Siegal, the founder of SEMI-THERM, gives a snapshot of the history of the symposium, the current event and the future of SEMI-THERM.
David Copeland Welcomes You to “The Heat is On” by MEPTEC
March 21st, 2012
Conference chair speaks about “The Heat is On,” a mini-conference of SEMI-THERM 28, which deals in the thermal management and packaging of electronic products and devices. The theme was evolutionary and revolutionary trends in the…read more
Recent Posts
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
- Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
- Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology
- IBM Awarded Contract in First Phase of DARPA ICECool Program
Latest Issue
Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- The Seebeck Coefficient 3 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 15 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
