Nextreme Thermal Solutions has announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature of 25°C. The 55°C temperature milestone, known as the ΔTmax, reflects the ability of the thermoelectric device to pump heat efficiently. This new level of performance translates to improved cooling efficiency, lower input power requirements, and greater opportunities for solving thermal issues in electronics, photonics and avionic applications.
55°C Cooling Performance Thin-Film Thermoelectric Coolers
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- Electronics Cooling December 2013 Issue Now Online
- Thermoelectric Coolers for High Temperature Environments
- Patent for Heat Spreader for IC Package, and IC Package Clamper Having the Heat Spreader
- New Gap Filler Offers Thermal Conductivity of 1.3W/m-K
- New Thermal Modeling Programs Offer Wide Range of Application Simulations
- Thermal Facts & Fairy Tales: How Useful Are Heat Sink Correlations for Design Purposes?
- Technique Combines Heat Sinks for More Effective Cooling
- New CFD Software Update Offers Efficient Handling of Advanced Designs
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the December 2013 issue
of Electronics Cooling, which includes feature articles on Energy-Efficient Warm-Water Cooling of Servers; Thermal Management of Many-core Processors using Power Multiplexing, Characterization of Server Thermal Mass; and more.
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- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 13 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 11 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 18 comment(s)
- Thermal Conductivity of Solders 2 comment(s)
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