Thin Cavity Fluidic Heat Exchanger

July 5th, 2012


Third Millennium Engineering has released a Thin Cavity Fluidic Heat Exchanger, a small volume, high performance method for cooling critical electronic devices at the chip, board, module, and system levels. Its high thermal performance originates from a very high velocity air flow, a very thin boundary layer, and high air utilization. It can efficiently and reliably cool critical regions in electronics with high design flexibility.

TCFHE technology is applicable from a micro to macro scale in power generation and distribution, defense, automotive, electronic, chemical, biomedical, and other industries.

Learn more from Third Millennium Engineering