NuSil Technology LLC presents EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, EPM1-2493 can be used to adhere materials with differing coefficients of thermal expansion (CTE) for significant stress reduction during thermal cycling.
EPM1-2493 does not have the typical paste-like consistency of other thermally conductive silicones. Rather, it is a pourable, conformal liquid that is excellent for potting/filling recessed areas and applying to intricate geometries in electronic applications. It can also be used for adhering integrated circuit substrates, base plates or heat sinks or where grooves or other configurations require a limited flow material.