On Mar. 27, 2013, Roger Stout, P.E. of ON Semiconductor presented a live webinar, “What Burns Me Up." Overview: Thermal errors, misconceptions and oversights occur on all levels; from semiconductor packaging, thermocouple theory, and infrared imaging; to cold fusion calorimetry and hot dense-plasma-focus fusion reactor design; to energy efficient architecture, plumbing and … [Read more...]
Archives for March 2013
EuroSimE 2013
April 15-17, 2013 Wroclaw, Poland Hosted by the Wroclaw University of Technology in Poland, the 2013 IEEE International Conference on thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems aims to promote further development and application of simulation methodologies and tools for the electronics industry, improve communication … [Read more...]
Thermal Analysis Tool with New Capabilities for Meta-Models, 3D Response Surface and Fast Batch Simulation
Mentor Graphics Corp. recently announced the addition of several new capabilities to its Flowmaster(R) simulation software solution for thermo-fluid systems, including features for pre-processing, simulation, data management and design collaboration. The new Flowmaster “experiments” capability allows users to “create response surfaces and export meta-model data as either … [Read more...]
Thermal Analysis Software Offers Wide Array of Measurement Tools, Image and Video Capture, Easy Camera Connectivity
Thermal imaging systems developer FLIR Systems has released a new, expanded version of its ResearchIR thermal measurement, recording and analysis software for research and development and advanced scientific applications. According to the company, ResearchIR features a wide array of measurement tools and charting and plotting capabilities for extensive image analysis, as well … [Read more...]
Heat Sink with Embedded Fan Suitable for Low-Profile Applications
Thermal solutions developer JARO Thermal has released the new “skive” cooler comprised of a 50x50x13 mm fan embedded inside a skived-copper-fin heat sink for low-profile applications including network interface cards, video graphic cards, PCI express and IC spot cooling. According to the company, “the dense arrangement of thin copper fins offers unheralded thermal … [Read more...]
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