A new book titled “Thermal Interface Materials 2015-2025: Status, Opportunities and Market Forecasts” has been released.
“The state of the market in 2015, a geographic breakdown of the market, and forecasts to 2025, are separated by TIM type and by application. These have been compiled after an extensive interview program with thermal interface material manufacturers making a variety of materials, and many different applications, and using financial data published by public companies. Thermal Interface Materials 2015-2025 includes profiles of 29 companies working in this industry.”
The book states that if a thermal interface material (TIM) is used appropriately with a device, it reduces cost, eliminates the need for liquid cooling, reduces system cooling power consumption, reduces building power consumption and increases operational lifetime.
The book also notes that the need for TIMs will always be modern, especially with technologies that are constantly growing in the industry, such as faster computers and electronic devices, greener lighting, and better connectivity. With electronics becoming more portable and compact, they become hotter much faster, thus the need for TIMs may never diminish.
Also summarized in the book are the top ten TIM technologies which include: pressure-sensitive adhesive tapes, thermal adhesives, thermal greases, thermal gels, pastes and liquids, elastomeric pads, phase change materials, graphite, solders and phase change metals, compressible interface materials and liquid metals.
The book addresses current and growing opportunities for TIMs and lists the following markets: LED lighting, telecommunications equipment, automotive electronics, aerospace and defense electronics, consumer electronics, medical electronics, testing equipment, wireless sensor networks and more.