Introduction The requisite thermal management for a microprocessor is most often achieved via an aluminum heat sink (fin structure) and a small fan. The effort discussed herein deals with the development of a ‘design for…read more
Design For Manufacturability Of Forced Convection Air Cooled Fully Ducted Heat Sinks
August 1st, 2007
Computer-related thermal packaging at the millenial divide
January 1st, 2000
Examples of state-of-the-art thermal management solutions at the dawn of the 21st century (left to right): a TCM module, a high-density heat sink, and an ultra performance, low profile fan-sink. Thermal management has served as…read more
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