Introduction Thermal management of electronic components must solve problems connected with the limitations on the maximum chip temperature and with the requirements on the level of temperature uniformity. To cool electronic components, one can use…read more
Use Of Heat Pipe Cooling Systems In The Electronics Industry
November 1st, 2004
Posted in Design, Heat Pipes, Heat Sinks, Test & Measurement | No Comments »
Tags: Heat Exchanger, Heat Pipe, Heat Sink, Phase Change, Thermal Conductivity
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