Author Archive for David Copeland

Energy Reduction and Performance Maximization through Improved Cooling

November 22nd, 2011

The International Technology Roadmap for Semiconductors [1] predicts high performance processor power density to more than double by the year 2024, while during the same time allowable junction temperature will decrease from 90oC to 70oC,…read more

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Review of Low Profile Cold Plate Technology for High Density Servers

May 1st, 2005

Introduction Water cooling of computers was introduced more than twenty years ago, but had disappeared from the mainstream by the mid 1990s. The conversion of chip technology from bipolar to CMOS (complementary metal oxide semiconductor)…read more

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