Author Archive for David H. Altman

Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power and Packaging Density Electronic Systems

March 14th, 2012

SINCE 2008, collaborative research conducted at Raytheon Company, Thermacore Incorporated, Purdue University and Georgia Tech Research Institute has pursued the development of Thermal Ground Plane (TGP) technology. The DARPA-sponsored Radio Frequency Thermal Ground Plane (RFTGP)…read more

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a case study to demonstrate the trade-offs between liquid and two-phase cooling schemes for small-channel heat sinks in high heat flux applications

April 30th, 2010

Introduction Small-channel heat sinks provide an extremely compact and efficient vehicle for dissipation of large heat fluxes typically found in high power electronics. Fluid flow and heat transfer in small-sized channels, with hydraulic diameters on…read more

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