Mentor Graphics is offering a new web-based tool for thermal characterization and design of semiconductor packages. FloTHERM® IC reduces the time spent on thermal characterization and design by providing an automated process that includes pre-verified…read more
High Thermal Conductivity Mounting Tape
August 1st, 2009
MH&W International’s Keratherm KL 90 is a highly thermally conductive, double-sided adhesive tape. It provides 1.4 W/mK of thermal conductivity – nearly three times higher than other thermal tapes – for more effective heat transfer…read more
Water and Air Coolers for Converters
August 1st, 2009
AMS Technologies offers customized Webra water and air cooling solutions for use in various converters and inverters in wind power, traction and industry applications. Offerings include water coolers for 62 mm IGBT modules, SKiiP, Primepack,…read more
Microscale Heat Pump
August 1st, 2009
Nextreme Thermal Solutions’ OptoCooler HV14 thermoelectric cooler (TEC) is the first module in a new class of high voltage and high heat pumping thermoelectric coolers that operate at low currents and are optimized for standard…read more
Easy Release Thermal Gap Pads
August 1st, 2009
Fujipoly has introduced specially formulated thermal interface gap pad materials that simplify board-level maintenance by reducing material tearing during disassembly for re-work and repair. Sarcon GR-H and XR-H thermal interface materials feature a unique hardened…read more
High-Performance Vane-Axial DC Fans
August 1st, 2009
Orion Fans has introduced a new line of vane-axial fans with superior airflow in exceptionally high static pressure environments. High performance VA Series DC fans feature a dual ball bearing system with a brushless DC,…read more
Convection and radiation heat loss from a printed circuit board
September 1st, 1998
In last issue’s column, a method for calculating the thermal conductivity of a printed circuit board (PCB) was described. Now, we look at a more complicated heat transfer process, namely the loss of heat from…read more
The thermal conductivity of gases
September 1st, 1998
The value of thermal conductivity for most gases and vapors range between 0.01 and 0.03 W/mK at room temperature. Notable exceptions are Helium (0.15) and Hydrogen (0.18). The most common theoretical explanation of heat conduction…read more
Disk drive reliability and thermal management
September 1st, 1998
Disk drive reliability and thermal management Hard disk drives are electromechanical systems which store information. They are the most complex electronic sub-assembly within a computer. If a microprocessor can qualify as the “heart” of a…read more
Conduction heat transfer in a printed circuit board
May 1st, 1998
In this issue, we examine heat flow in a printed circuit board (PCB), which typically is a layered composite consisting of copper foil and a glass-reinforced polymer (FR-4). A cross-sectional view of such a laminated…read more
The thermal conductivity of silicon
May 1st, 1998
The most important material within the semiconductor industry is Silicon. When dealing with electro-thermal device modelling, or the interpretation of fast transient techniques for the measurement of thermal impedance, thermal conductivity of Silicon is required.…read more
Pressure drop coefficients for thin perforated plates
May 1st, 1998
Almost everyone working on pressure drop coefficients of perforated plates encounters the work of I.E. Idelchick {1}. A plethora of graphs or equations – some of which are impossible to evaluate quickly – must then…read more
Fan selection – quick techniques to compare various tube-axial fan designs
January 1st, 1998
The worldwide market for tube-axial fans is very large and, as a consequence, the number of tube-axial suppliers is significant. This article will focus on the techniques that can be used to quickly compare various…read more
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