Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and…read more
Electroosmotic Microchannel Cooling System for Microprocessors
November 1st, 2002
Posted in Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Semiconductor, Technical Brief | No Comments »
Tags: Electroosmotic, Heat Pipe, Heat Sink, Microchannel Cooling, Microprocessor
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