Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and…read more
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the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
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