Computer heat sinks, such as fin arrays and heat pipes, are much larger than silicon chips and are continuing to grow in size. This trend is driven by the increasing chip heat generation rates and…read more
Electroosmotic Microchannel Cooling System for Microprocessors
November 1st, 2002
Posted in Coolers, Design, Heat Pipes, Heat Sinks, Liquid Cooling, Semiconductor, Technical Brief | No Comments »
Tags: Electroosmotic, Heat Pipe, Heat Sink, Microchannel Cooling, Microprocessor
Sign Up
Get our newsletter delivered to your email inbox.
Recent Posts
- Thermally Conductive Acrylic Interface Pads Provide ‘Excellent Conformability’ and ‘Compressive Stress Relaxation’
- Electronics Cooling Simulation Software Enables ‘Earlier Virtual Prototyping’, ‘Fewer Design Iterations’ in MDA and EDA Domains
- Special Evening Program at SEMI-THERM March 20
- Workshop on Composite Preforms at SEMI-THERM
- Fourth Quarter Financial Results Conference Call
- Heat Transfer at ‘Any Temperature’ Makes Thermal Interface Film Suitable for Cold Plate Applications
- SEMI-THERM Draws Thermal Engineers; View Our Photos
- SEMI-THERM Presents Executive Briefing
Latest Issue

Don’t miss out on
the March 2013 issue
of Electronics Cooling, which includes feature articles on the Benefits and Drawbacks of Using Two-Phase Cooling Technologies in Military platforms, Measured Thermal Resistance of Microbumps in 3D Chip Stack, and more.
View Issue »
Popular Posts
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 2 comment(s)
- The Seebeck Coefficient 3 comment(s)
- The Thermal Conductivity of Moist Air 5 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Heat pipes for electronics cooling applications 8 comment(s)
- Notes on Using Thermocouples 9 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 11 comment(s)
- Thermal Conductivity of Solders 2 comment(s)




