(Editor’s Note: Part 1 of this article appeared in the August 2003 issue of ElectronicsCooling. Illustration references in this part begin with Figure 5.) Cooling electronic systems is one of the major focal points of…read more
Cooling Technology Options
August 1st, 2003
(Editor’s Note: Part 2 of this article will appear in the November 2003 issue of ElectronicsCooling.) Cooling electronic systems is one of the major focal points of the design process and the key to a…read more
How Much Heat can be Extracted from a Heat Sink?
May 1st, 2003
Thermal transport from a heat sink creates a unique condition in heat transfer and fluid flow once it is placed on a PCB in an unducted fluid flow delivery system. Although a heat sink may…read more
Visualization of air flows in electronics systems
May 1st, 2001
The three-dimensional shape and irregular nature of electronic component topologies on air-cooled Printed Circuit Boards (PCBs) give rise to complex air flow patterns that have been well documented [1]. Even laminar flows over relatively simple…read more
Managing power requirements in the electronics industry
December 1st, 2000
Rapid growth in the use of Internet and telecommunication services has created unique yet critical demands on the power required to energize this network. Continuing market requirements for higher-speed access – coupled with expanding needs…read more
The history of power dissipation
January 1st, 2000
Figure 1. Transistor counts on Intel processors from inception to present superimposed on Moore’s prediction. In his fascinating book, “Visions,” Michio Kaku [1] predicts a future driven by silicon and quantum computers. Based on the…read more
Measuring fluid velocity in electronic enclosures
January 1st, 1998
Thermal analysis and characterization of electronic systems requires a knowledge of fluid velocity. In pursuit of this information, we often resort to measurement or calculation. The issue of measurement becomes a challenge since we are…read more
Measuring chip temperatures with thermochromic liquid crystals
January 1st, 1997
Introduction Measurement of the temperature distribution of an operating electroniccomponent, including its junction and case temperatures, is necessary tocompletely characterize the thermal and electrical performance of today’s highpower density electronic components. As part of the…read more
Evaluation of different heat transfer coefficient definitions
June 1st, 1995
The analysis of convective heat transfer problems pivots on the accurate knowledge of the heat transfer coefficient, h. The heat transfer coefficient is affected by many parameters which have been defined differently by various investigators.…read more
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