Author Archive for M. M. Yovanovich

Natural convection modeling of heat sinks using web-based tools

September 1st, 2000

Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the…read more

Posted in Design, Heat Pipes, Software, Test & Measurement | No Comments »

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Calculating interface resistance

May 1st, 1997

Figure 1. Ceramic Package – Aluminum Heat SinkAssembly Introduction The exposed surface area of many of today’s high powered electronic packagesis no longer sufficient for the removal of the heat generated during normaloperation. Heat sinks…read more

Posted in Ceramics, Design, Heat Sinks, Test & Measurement | No Comments »

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