The development, specification, and quality control of materials used in electronics packaging and thermal management often require the measurement of thermophysical properties.This data can be critical to a successful design, especially with the rapidly increasing…read more
Recent Posts
- Researchers Control Heat Flow with Atoms
- SEMICON West 2012
- Summer Heat Transfer Conference
- IMS2012 International Microwave Symposium
- Multi-Port Cages with Thermal Management
- 55°C Cooling Performance Thin-Film Thermoelectric Coolers
- A Little Goes A Long Way (But A Lot Doesn’t Go Much Further)
- Significant Changes to the NFPA 70E Standard 2012 Edition
Latest Issue
Don’t miss out on
the March 2012 issue
of Electronics Cooling, which includes the 2012 Buyers' Guide as well as features on ionic winds, heat spreading, thermal ground plane technology, and microchannel cooling.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- Heat pipes for electronics cooling applications 7 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Notes on using thermocouples 5 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- All you need to know about fans 1 comment(s)
- Air Flow through Cooling Technology for Aerospace Systems - http://t.co/MhAiN39R #
- Still Haven’t Downloaded the Electronics Cooling Buyers’ Guide App? Download it today & see what you are missing - http://t.co/slVy0vYX #
- Cold Atoms Simulate Graphene - http://t.co/acjUaMBp #
- Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power & Packaging Density Electronic Systems - http://t.co/uZ4Czy5S #
