Robert Simons Editor-in-Chief, Winter 2010 Issue Resolutions As you read this editorial we are fast approaching the end of another year. For some, this is a time for introspection. Who has not, at sometime, looked…read more
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
May 1st, 2009
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a…read more
A Simple Method to Estimate Boiling Heat Sink Performance
February 1st, 2009
Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for…read more
Reader Poll Declares ElectronicsCooling a Winner!
August 1st, 2008
Reader Poll Declares ElectronicsCooling a Winner! Here in the United States we are in the midst of the campaign season leading to our national election in November to choose our next president. While Senator John…read more
Estimating Dew Point Temperature For Water Cooling Applications
May 1st, 2008
Over the past several years thermal engineers and others in the computer industry have become acutely aware of the challenge of increasing power dissipation and the potential of liquid (principally water) cooling to provide a…read more
Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers
February 1st, 2008
Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner…read more
Thanks and Congratulations
August 1st, 2007
Since the first issue of ElectronicsCooling magazine emerged in June 1995, I have had the privilege of publishing a number of feature articles in the magazine. Writing these articles came relatively easy because the topics…read more
Estimating the effect of intercoolers for computer rack cooling
May 1st, 2007
Figure 1. Four board high rack with serial air flow configuration. Figure 2. Rack with intercoolers cooled by water flowing parallel to air flow direction. In the February 2007 issue of ElectronicsCooling the Calculation Corner…read more
Using a simple air recirculation model to explore computer rack cooling
February 1st, 2007
Figure 1. Schematic diagram of simple computer rack air recirculation model. Figure 2. Schematic diagram of computer rack air recirculation model with heat exchanger in rear of computer rack. In an article in the November…read more
Effect Of Improved Thermoelectric Zts On Electronic Module Coolability
November 1st, 2006
In recent years there has been a growing interest in the application of thermoelectrics to electronics cooling. Attention has been focused on thermoelectric cooling both as a possible means to enhance module cooling and to…read more
Comparing Heat Transfer Rates of Liquid Coolants Using the Mouromtseff Number
May 1st, 2006
As many readers of ElectronicsCooling are aware, there is a growing interest in the electronics cooling community in the possible use of liquid cooling. This interest is, of course, due to the trend of increased…read more
A Simple Thermal Resistance Model – Isoflux Versus Isothermal
February 1st, 2006
In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a…read more
Advances In High-Performance Cooling For Electronics
November 1st, 2005
Introduction The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems. In many instances standard techniques cannot achieve the required cooling performance due to physical…read more
High Powered Chip Cooling — Air and Beyond
August 1st, 2005
Introduction Over the past few years many people in the electronics industry have become concerned with the increases in heat density at both the chip and module level of packaging. This trend is not new…read more
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