Introduction The thermal resistance of a heat sink is a convenient way of describing its performance but, unlike its electrical counterpart, the thermal resistance of a heat sink is not a constant: it changes significantly…read more
The Benefits Of Using Hadiabatic In Thinking About Electronics Cooling
February 1st, 2004
The heat transfer coefficient is used to describe convective heat transfer between a solid and a fluid, as in Equation (1). The heat transfer coefficient is a defined parameter, not a physical property like thermal…read more
Uncertainty analysis
May 1st, 1999
Uncertainty analysis is the process of estimating the uncertainty in a result calculated from measurements with known uncertainties. Uncertainty analysis uses the equations by which the result was calculated to estimate the effects of measurement…read more
Notes on Using Thermocouples
January 1st, 1997
Introduction Thermocouples are the most widely used temperature sensor in test anddevelopment work. Accurate temperature measurements can be made at low costwith shop-built probes and ordinary low-level voltmeters. What Are Thermocouples and How Do They…read more
Evaluation of different heat transfer coefficient definitions
June 1st, 1995
The analysis of convective heat transfer problems pivots on the accurate knowledge of the heat transfer coefficient, h. The heat transfer coefficient is affected by many parameters which have been defined differently by various investigators.…read more
Recent Posts
- Preventing Thermal & Vibration Failures in Electronic Equipment
- Thermoreflectance Thermal Imaging System for Quality Control and Reliability Analysis
- Software Suite Handles Massive Data Flows Generated by Thermal Sensors
- Nanolaser Technology Room-Temperature Breakthrough Could Facilitate Faster Computer Operation
- Nanoscale Heat Transfer Research Awarded Air Force Grant
- Thermal Characterization Tools for Testing and Evaluation of TIM Materials
- Joint Venture for Development of “Next Generation” EV and LED Thermal Management Systems Announced
- Experiment vs. Simulation, Part 5: Detailed IC Package Model Calibration Methodology
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