Author Archive for S. B. Sathe

Parameters affecting package thermal performance a low end system level example

May 1st, 2001

Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power…read more

Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »

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Interaction of the system and module-level thermal phenomena- a flip-chip/BGA example

May 1st, 1998

Fig. 1: Levels in a computer environment. Introduction Increasing demands for higher performance in microprocessors have a direct effect on chip power and heat generation. Increased function and miniaturization of the packages result in thermal…read more

Posted in Blowers / Fans / Filters, Computer, Data Centers, Design, Heat Sinks, IT Products, Semiconductor, Test & Measurement | No Comments »

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