Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more
Cooling Options And Challenges Of High Power Semiconductor Modules
November 1st, 2006
Posted in Automotive, Design, Heat Sinks, Liquid Cooling, Power, Semiconductor | No Comments »
Tags: Cold Plate, Heat Pump, High Power, IGBT, MOSFET, Power Modules, Thermal Resistance
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