Introduction Existing technologies typically utilize air to carry the heat away from a heat sink that is thermally coupled to the microprocessor. Higher performance devices such as workstations, “gaming” PCs, or tower servers that utilize…read more
Thermal Optimization And Design For Manufacturability Of Liquid-Air Hybrid Cooling Systems
August 1st, 2008
Micropumping Technologies for Electronics Cooling
May 1st, 2006
Introduction Traditional cooling approaches, consisting typically of external air-cooled heat sinks, are increasingly falling short in meeting the thermal management challenges of emerging electronic systems. Integrated cooling designs are being investigated to eliminate some of…read more
Prediction of Thermal Contact Resistance
November 1st, 2003
All engineering surfaces exhibit some level of microscopic roughness. The resistance to heat flow through a contact interface occurs because only a small portion (usually 1-2%) [1] of the nominal surface area is actually in…read more
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