Author Archive for V. V. Calmidi

Parameters affecting package thermal performance a low end system level example

May 1st, 2001

Thermal management of electronic equipment is a dynamic process. For example, the anticipated power trends for CMOS technology can be found in the roadmaps of [1 and 2]. They closely follow the rapidly rising power…read more

Posted in Design, Materials, Compounds, Adhesives, Substrates, Semiconductor, Test & Measurement | No Comments »

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