Introduction
The role of thermal interface materials (TIM) to augment heat flow in electronics has been well-documented [1-4]: Higher thermal conductivity (k) and thinner bondlines proportionally…read more
Mini- and Microchannels in Thermal Interfaces: Spatial, Temporal, Material, and Practical Significance
February 1st, 2009
Posted in Applications, Materials, Compounds, Adhesives, Substrates, TIMs | No Comments »
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