Marlow Industries’ new Triton ICE thermoelectric module series is inspired by sub-zero temperatures on Neptune’s moon Triton; the coolers can improve customer electronic systems in thermal performance, cost, noise, weight, size or efficiency. The new…read more
GE Invests in LED Cooling Technology Creator
July 22nd, 2011
GE has provided capital and entered into a license agreement to access Nuventix’s patent portfolio. Nuventix developed a method for moving air to cool LEDs using a single oscillating membrane, called a SynJet®, as an…read more
College Physics Department Researching Quantum Nature of Atoms
July 22nd, 2011
A group led by Seth Aubin, assistant professor of physics at William & Mary, is putting finishing touches on an apparatus that will chill atoms to near absolute zero. At these low temperatures, the quantum…read more
Company Expands Line of Passive Thermal Management Devices
June 28th, 2011
International Manufacturing Services, Inc. (IMS) has expanded its line of Therma-Bridge™ thermal transfer devices by adding several new sizes. The Therma-Bridge™ is an electrically isolated, surface mountable chip device used to thermally conductive heat away…read more
Research Reveals Rankings of New HVAC Technologies
June 28th, 2011
In a report titled “Uncovering Attractive Innovations in HVAC Amidst Evolutionary Growth,” Lux Research surveys the field of incumbent and emerging HVAC technologies, reviews the geographical, regulatory and economic factors influencing adoption and assesses which…read more
Cold Plates for Demanding Military Cooling Applications
March 18th, 2011
Thermacore introduces a new line of cold plates that meet the most recent VME64x/VPX standards and supports commercial off-the-shelf packaging formats. With the thermal performance and flexibility these cold plates offer, military embedded system designers…read more
Reasons to Use Two-Phase Refrigerant Cooling
March 1st, 2011
Water-cooling at the rack appears to be the new short-term technological solution for server cooling in datacenters, with its advantages over traditional cold aisle/hot aisle air-cooling being clear, as can be seen in [1]. Bringing…read more
Energy Efficiency Expo 2011 Abstracts
February 4th, 2011
Deadline: March 10 Energy Efficiency Expo 2011, to be held Sept. 20-21 in Nashville, Tenn., is accepting presentation abstracts for the international trade fair showcasing products and services to help organizations reduce their energy consumption…read more
Dual Tower Cooler with More Heat Pipes, Dimpled Fans
January 10th, 2011
Spire Corp. recently introduced its new high-end tower CPU cooler. Spire codenamed its newest thermal solution Gemini, the Zodiac sign for twins, due to the two towering dimpled fin heat-sinks. The increased number of heat-pipes…read more
New Electric Car Includes Thermally Controlled Battery Pack
January 10th, 2011
Under the hood of the Ford Focus Electric, unveiled at the 2011 Consumer Electronics Show in Las Vegas, a 100 kilowatt AC motor provides 181 lb.-ft of torque and can propel the Ford Focus Electric…read more
New Laptop and iPad™ Cooling Products Introduced
January 10th, 2011
ThermaPAK’s new products incorporate the company’s HeatShift Technology®, which brings down the temperature of long-running electronic devices to comfortable operating temperatures. The HeatShift Technology begins working once the gadget is placed on the pad. Grooved…read more
Report: Thermal Management Technologies to Reach $8.6 Billion by 2015
January 10th, 2011
The global market for Electronic Thermal Management is forecast to reach $8.6 billion by 2015, according to market research company Electronics.ca Publications. Factors driving growth include developments in technology and marked increase in the production…read more
Computers that Recycle Energy among Top IT Innovations
December 27th, 2010
Computers that can recycle energy are among the scenarios IBM Corp. predicts over the next five years as part of its annual “Next Five in Five” year-end innovations report based on technologies being developed in…read more
TECs for Larger Heat Pumping Applications
December 14th, 2010
Nextreme Thermal Solutions recently introduced the eTEC HV56 module, the next product in its high-voltage (HV) line of thin-film thermoelectric coolers (TECs) designed to address electronics cooling applications with larger heat pumping requirements. At 85°C,…read more
Recent Posts
- Researchers Control Heat Flow with Atoms
- SEMICON West 2012
- Summer Heat Transfer Conference
- IMS2012 International Microwave Symposium
- Multi-Port Cages with Thermal Management
- 55°C Cooling Performance Thin-Film Thermoelectric Coolers
- A Little Goes A Long Way (But A Lot Doesn’t Go Much Further)
- Significant Changes to the NFPA 70E Standard 2012 Edition
Latest Issue
Don’t miss out on
the March 2012 issue
of Electronics Cooling, which includes the 2012 Buyers' Guide as well as features on ionic winds, heat spreading, thermal ground plane technology, and microchannel cooling.
View Issue »
Most Popular Posts
- The Thermal Conductivity of Moist Air 4 comment(s)
- The Seebeck Coefficient 2 comment(s)
- Simplified Formula for Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate 0 comment(s)
- Heat pipes for electronics cooling applications 7 comment(s)
- Advances In High-Performance Cooling For Electronics 11 comment(s)
- Notes on using thermocouples 5 comment(s)
- Estimating Parallel Plate-Fin Heat Sink Thermal Resistance 1 comment(s)
- All you need to know about fans 1 comment(s)
- Air Flow through Cooling Technology for Aerospace Systems - http://t.co/MhAiN39R #
- Still Haven’t Downloaded the Electronics Cooling Buyers’ Guide App? Download it today & see what you are missing - http://t.co/slVy0vYX #
- Cold Atoms Simulate Graphene - http://t.co/acjUaMBp #
- Thermal Ground Plane Vapor Chamber Heat Spreaders for High Power & Packaging Density Electronic Systems - http://t.co/uZ4Czy5S #
