In today’s electronics equipment, total system dissipated power levels are increasing with every new design. Increases in power levels combined with the market expectation of reduced package sizes lead to heat problems that, if uncontrolled,…read more
Natural convection modeling of heat sinks using web-based tools
September 1st, 2000
Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the…read more
Heat pipe fundamentals
May 1st, 1999
The use of heat pipes in thermal management is increasing rapidly as power densities in electronics continue to rise. Heat pipes are attractive because they can typically carry 100 or more times as much heat…read more
Heat pipes for electronics cooling applications
September 1st, 1996
Figure 1: Heat pipe operation Introduction All electronic components, from microprocessors to high end powerconverters, generate heat and rejection of this heat is necessary for theiroptimum and reliable operation. As electronic design allows higher throughputin…read more
Thermal control of space electronics
September 1st, 1996
Introduction Telecommunication satellites are all based on the same overall design usinga 3 axis stabilization process, in which the North and South panels act asradiators and so ensure heat removal. This basic principle is illustrated…read more
Applying computational fluid dynamics to heat sink design and selection
January 1st, 1996
Abstract This article describes how Computational Fluid Dynamics (CFD) can help inthe selection and/or design of a heat sink for electronics cooling applications.CFD modeling complements the other tools in the thermal tool kit: calculationsbased on…read more
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