Polyonics’ new family of temperature and chemical resistant tapes remain dimensionally stable in extreme manufacturing environments including ultra-high temperatures up to 500°C. The tapes are specifically engineered using Polyonics ThermoGard™ technology to isolate sensitive, precise…read more
Fluoropolymer Composite and Liquid-Crystal-Polymer Laminates
September 27th, 2011
Rogers Corporation’s RT/duroid 6035HTC is a high-thermal-conductivity fluoropolymer composite that contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear. The thermally stable material has a z-axis dielectric constant…read more
Companies Team Up to Develop Adhesives to Create 3D Semiconductors
September 27th, 2011
3M and IBM plan to jointly develop the first adhesives that can be used to package semiconductors into densely stacked silicon “towers.” The companies are aiming to create a new class of materials, which will…read more
Low Compression, High Performance Thermal Gap Filler
September 12th, 2011
Fujipoly’s new Sarcon® GR-SL is a low compression and high-performance thermal gap filler material. When placed on top of uneven components, this material quickly conforms to all gaps, peeks and air pockets making a level,…read more
Companies Sign Distribution Agreement
September 12th, 2011
Ellsworth Adhesives Australia Pty Ltd is now an authorized distributor for 3M’s Industrial Adhesives and Tapes Division (IATD) in Australia. The 3M Industrial Adhesives and Tapes Division features extensive product lines in Packaging Tape and…read more
Affordable Solar Panels
August 22nd, 2011
Applied Nanotech has developed a way to make some solar technology cheaper, which could reduce the cost of solar panels. Solar panels are made up of a collection of solar wafers, and the company is…read more
Gap Filler Has Thermal Conductivity of 1.6 W/m-k
August 5th, 2011
T-Global Technology Ltd’s new gap filler, L37-5S, has a Shore OO hardness of 3 and a thermal conductivity of 1.6 W/m-k. It is specifically aimed at consumer electronics and LED applications where optimum performance is…read more
Wide Input Range 400 Watt DC DC Converter
August 5th, 2011
Calex Mfg. Co., Inc.’s new 400 Watt FBW DC DC Converter Series offers a 9-36 VDC and 18-75 VDC input range in a 4.6″ x 2.4″ x 0.55″ high package. The wide input range provides…read more
University Receives Grant for Silicon-Based Technologies Research
July 22nd, 2011
The University of Warwick Department of Physics has been awarded a five-year £1.7 million grant for “Creating Silicon Based Platforms for New Technologies.” The initiative will bring in new technologies ranging from energy harvesting to…read more
Non-Flowing Silicone-Based Thermal Grease
July 11th, 2011
Fujipoly’s new Sarcon® SG-26SL silicone-based thermal grease delivers a thermal conductivity of 2.6 W/m°K while exhibiting minimal bleed and evaporation characteristics. The non-flowing consistency of Sarcon® SG-26SL makes the grease ideal for power converter and…read more
Distributor Offers Flame Retardant Products
June 28th, 2011
Ellsworth Adhesives now offers Devcon Flame Retardant products including Devcon 5 Minute I-FR and Devcon 10 Minute Epoxy I-FR. Devcon Flame Retardant products are ideal for applications requiring a self-extinguishing structural system. The products are…read more
Thermally Conductive Epoxy
May 20th, 2011
Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. This two component adhesive, sealant, and coating…read more
Soft, Conformable Gap Filler
May 9th, 2011
T-Global’s new high performance gap filler TG-X is designed to offer the user the ultimate combination of thermal performance and extreme conformability. TG-X is soft, conformable, cost-effective and offers a thermal performance of 12 W/m-k.…read more
Company Hires New Chief Technology Officer
May 5th, 2011
Stablcor Technology, Inc. has appointed William E. Davis as Chief Technology Officer. Davis created the concept that became the basis for STABLCOR® Technology and is listed as an inventor on three of Stablcor Technology, Inc.’s…read more
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