Introduction Significant increases in temperature are believed to contribute to losses in reliability and performance, and can present serious complications to thermal management. The net thermal effect depends on a combination of factors related to…read more
When Moore Is Less: Exploring the 3rd Dimension in IC Packaging
February 1st, 2009
Introduction As consumers of electronics we have become spoiled. We not only expect our electronic devices to get smaller, faster, more functional, cheaper, more interconnected, and more reliable, we actually demand it. It would not…read more
Power Map Calculations Using Image Sources and Superposition
November 1st, 2008
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more…read more
Thermal Modeling Approaches Of GaAs Semiconductors
February 1st, 2008
Introduction Predicting gallium arsenide (GaAs) semiconductor temperature is imperative since it affects the performance and reliability of the chip and the design as a whole. In many circumstances, the thermal engineer will be asked to…read more
Thermo-Reflectance Thermography For Submicron Temperature Measurements
February 1st, 2008
The primary approach to maintaining the aggressive progress in the microelectronics industry has been to increase the density of elementary transistors and to reduce the size of their active areas. As a result, the removal…read more
A Practical Implementation Of Silicon Microchannel Coolers
November 1st, 2007
Introduction More than twenty-five years ago, Tuckerman and Pease first described the use of silicon microchannel cooling for very high power densities [1]. However, the coolers could not be fabricated easily and pressure drops were…read more
Cooling Options And Challenges Of High Power Semiconductor Modules
November 1st, 2006
Introduction Trends in power electronics systems and devices over the last decade have placed increasing demands on the efficiencies of the thermal management systems used for power Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) and Insulated…read more
Thermal Challenges In LED Cooling
November 1st, 2006
Introduction During the last ten years, developments in LED semiconductors have led to an important change in LED applications from that of luminous indicator to that of illuminator. With LEDs now advancing into several lighting…read more
Toward A Thermal Figure Of Merit For Multi-Chip Packages
November 1st, 2006
Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue’s Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP)…read more
Exploring the Limits of Air Cooling
August 1st, 2006
Introduction Heat from electronic devices is an integral part of information processing, not a nuisance that can someday be eliminated. This is a physical principle that is independent of the device of information processing. However,…read more
Packaging Challenges For High Heat Flux Devices
August 1st, 2006
Introduction It comes as no surprise to anyone in our industry that device power levels are increasing to support customer expectations of ever greater functionality and performance. The greatest thermal challenges in computing occur in…read more
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
August 1st, 2006
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use…read more
Solid-State Microrefrigerator on a Chip
August 1st, 2006
Introduction Temperature control of microelectronic devices has become more important in recent years. Device miniaturization and higher switching speeds have increased power dissipation substantially. Limiting the maximum die temperature has resulted in an increase of…read more
Direct Die Attach Using a Room Temperature Soldering Process
May 1st, 2006
As the power and power density of IC components continue to rise [1], the need to effectively dissipate the heat to ensure long-term reliability has increased [2]. The largest contributor to the total thermal resistance…read more
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