This paper describes a new CFD-based modeling capability and design methodology that overcomes the limitations of conventional guidelines and traditional CFD-based approaches and is effective at addressing equipment related cooling and efficiency problems in the…read more
LED Design Case Study: Lighter Thermal Management with Simulation
January 25th, 2011
Future Facilities Incorporated recently released a case study showing that its new CFD software for electronics cooling design, 6SigmaET, solves the problem of how to shrink electronics devices that generate heat. The study describes how…read more
Software-Connected Hardware Platform Provides Enhanced Measurement
January 10th, 2011
Corsair’s new Link™ technology allows multiple Corsair products to be connected to the Corsair Link Controller, providing enhanced measurement and control capabilities. Corsair products that includes a Corsair Link connector can be linked to the…read more
Software Modeling to Determine Heat-Related Problem Spots
November 22nd, 2010
Managing heat generation and dissipation in today’s compact and complex electronic world requires the attention of designers and manufacturers alike. It is also a system-wide problem, because optimizing a thermal problem in one area—whether it’s…read more
Firm Receives Contracts for U.S. Navy Gun Computer System Cabinets
October 11th, 2010
The Electronics Group of Orbit International Corp, an electronics manufacturer and software solution provider, has received several awards from a U.S. Navy Procurement Agency valued in excess of $2,465,000 for its MK 119 Gun Computer…read more
The Uses of Simplicity in Thermal Analysis
July 26th, 2010
Bruce Guenin, PhD Editor-in-Chief, Summer 2010 Issue The dramatic trajectory of Moore’s law has produced a number of changes in key areas of technology that are critical to our industry: 1) greater packaging and system…read more
±0.5% Tolerance Chip NTC Thermistors
May 10th, 2010
Murata Electronics North America added the ±0.5% tolerance option to its NCP series negative temperature coefficient (NTC) thermistor line. The ultra-tight tolerance thermistor is offered for consumer, industrial and automotive temperature ranges (-40°C to +150°C),…read more
Thermal/EMI Combination Shield Design Case Study
May 10th, 2010
Laird Technologies, Inc. recently released its thermal/EMI combination shield design case study, which discusses in detail the process of how thermal simulation software was utilized in the design of a thermal/EMI combination shield. Instead of…read more
IC Package Thermal Characterization Made Easy
April 13th, 2010
FloTHERM® IC is a new Web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design. Developed with the needs of design engineers and…read more
Enhanced Version of Thermoelectric Module Simulation Software
April 12th, 2010
Laird Technologies, Inc. recently launched an enhanced version of its online thermoelectric module (TEM) simulation software tool: AZTEC™. AZTEC selects the optimal TEM(s) for trial from a given set of input variables based on application…read more
Software Tool Available for Simulating Cooling Performance of Data Center
April 12th, 2010
Innovative Research, Inc. recently released TileFlow 4.2, a new version of its three-dimensional software tool for simulating cooling performance of data center. TileFlow now allows users to include upflow CRAC units in the data center…read more
CFD: One measly letter away from CAD
February 1st, 2001
“The stuff you engineers design is too good,” the guy from Marketing said, “I need shoddier! Can you make them less efficient and cheaper?” I was working for a small company that made electric power…read more
Natural convection modeling of heat sinks using web-based tools
September 1st, 2000
Heat transfer in electronic packages is a complex problem involving a network of resistive paths for the various laminated structures, bonding adhesives, lead frames, and attachment mechanisms, such as ball grid arrays. However, despite the…read more
Thermal analysis moves into the 21st century
January 1st, 2000
In the last decade, we’ve come a long way in the application of thermal analysis to the design of electronics. And there’s no sign of the pace of innovation changing. Engineers are still being challenged…read more
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