Software

Applying computational fluid dynamics to heat sink design and selection

January 1st, 1996

Abstract This article describes how Computational Fluid Dynamics (CFD) can help inthe selection and/or design of a heat sink for electronics cooling applications.CFD modeling complements the other tools in the thermal tool kit: calculationsbased on…read more

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DELPHI – A status report on the European -union funded project for the creation and validation of thermal models on electronic parts

January 1st, 1996

The accurate prediction of the operating temperatures of critical electronicparts at the component-, board- and system-level is seriously hampered by thelack of reliable, standardised input data. The DELPHI project is addressing thisproblem by the development…read more

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Electronic package characterization per JEDEC standard

January 1st, 1996

Introduction With the increase in power density resulting from advancements insemiconductor packaging technologies comes the issue of heat dissipation. Heatis generated as a result of electrical energy being converted to thermal energyduring circuit activities. The…read more

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Safety tips and techniques for FEA in modeling solids

June 1st, 1995

Using commercially available finite element analysis (FEA) software is easier today than it has ever been. Software vendors have made great progress toward providing programs that are as easy to use as they are powerful.…read more

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