Mouser Electronics, Inc. and The Bergquist Company have signed a global distribution agreement. Under the new agreement, Mouser will distribute Bergquist’s portfolio of thermal management materials, which includes Sil-Pad®, thermally conductive insulators and various specialty…read more
Thermal Solver with Heat Transfer Simulation Package
November 21st, 2011
MAYA HTT’s TMG-Thermal solver provides a comprehensive heat transfer simulation package, which allows fast and accurate solutions to complex thermal problems. Using finite difference control volume technology, TMG-Thermal makes it easy to numerically simulate nonlinear…read more
Miniaturization a Driving Force in Thermal Management Technologies Market
November 8th, 2011
By 2016 the thermal management technologies market will be worth nearly $11 billion, compared with a 2010 value of $7.5 billion and $8 billion in 2011. According to a new report available on companiesandmarkets.com, this…read more
Gap Filler Pad with Low-Tac Top Surface
October 11th, 2011
Fujipoly’s new Sarcon® 50G-Hm is a high performance, low resistance gap filler pad manufactured with a special low-tac top surface. The one-sided treatment is less sticky than the opposing surface allowing the thermal pad to…read more
Tapes Protect Components from Harsh Environments
October 11th, 2011
Polyonics’ new family of temperature and chemical resistant tapes remain dimensionally stable in extreme manufacturing environments including ultra-high temperatures up to 500°C. The tapes are specifically engineered using Polyonics ThermoGard™ technology to isolate sensitive, precise…read more
Fluoropolymer Composite and Liquid-Crystal-Polymer Laminates
September 27th, 2011
Rogers Corporation’s RT/duroid 6035HTC is a high-thermal-conductivity fluoropolymer composite that contains a unique filler system, enabling a thermal conductivity of 1.44 W/m/K while maintaining low drill wear. The thermally stable material has a z-axis dielectric constant…read more
Standard Test Method for Pressure Calibration of Thermal Analyzers
July 22nd, 2011
This test method, ASTM E2744-10, describes the calibration or performance confirmation of the electronic pressure signals from thermal analysis apparatus. The values stated in SI units are to be regarded as standard. No other units…read more
Non-Flowing Silicone-Based Thermal Grease
July 11th, 2011
Fujipoly’s new Sarcon® SG-26SL silicone-based thermal grease delivers a thermal conductivity of 2.6 W/m°K while exhibiting minimal bleed and evaporation characteristics. The non-flowing consistency of Sarcon® SG-26SL makes the grease ideal for power converter and…read more
Thermally Conductive Grease Used for Solar Industry
May 10th, 2011
A product that is proving useful to the solar industry is LORD Corporation’s TC-501 Thermally Conductive Grease. This solvent-free, silicone thermal interface material (TIM) is designed to replace greases used as TIMs between the heat…read more
Hot STM Captures Thermal Decomposition in situ at the Nanoscale
May 10th, 2011
A new report in the journal Nanotechnology offers findings of a nanoscale in situ investigation of ultrathin silicon oxide thermal decomposition by high temperature scanning tunneling microscopy. A surface chemical reaction—the thermal decomposition of ultrathin…read more
Professor Lauded for Nanotechnology Work
May 10th, 2011
Dr. Alexander A. Balandin, professor of electrical engineering and founding chair of materials science and engineering at the University of California – Riverside, was selected to receive the IEEE Pioneer of Nanotechnology Award for the…read more
Silicone Putty Thermal Interface Material
April 8th, 2011
Fujipoly’s Sarcon® XR-v-AL is a uniquely formulated silicone thermal interface material that offers the installation flexibility of a putty-like sheet. Sarcon® XR-v-AL provides a thermal conductivity of 6.0 W/m°K and thermal resistance of just .04…read more
Common Metallic TIMs in One Kit
March 14th, 2011
This low cost kit from AIM Specialty Materials provides engineers with foils in a range of compositions and thicknesses which can be cut into any configuration for testing and development of effective thermal interfaces in…read more
Report Reviews Thermal Interface Material Market
February 21st, 2011
A report from marketing research company Japan Marketing Survey (JMS), “Outlook of Thermal Interface Material Market 2010,” offers data on the thermal interface material market and thermal filler market. The report is organized by market…read more
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