Don’t miss out on the December 2011 issue of ElectronicsCooling, which includes feature articles on data center design, electro-thermal simulation of power, energy reduction and performance maximization as well as technical briefs. If you would…read more
Calculation Corner: Transient Modelling of a High-Power IC Package, Part 1
November 22nd, 2011
There is an increasing need for calculating integrated circuit temperatures during conditions of changing chip power. Varying computer workloads and the implementation of power-saving strategies are leading to greater variability in chip power levels than…read more
ElectronicsCooling Winter 2010 Issue
December 6th, 2010
Don’t miss out on the Winter 2010 issue of ElectronicsCooling, which includes a sneak peek at SEMI-THERM 27, feature articles on open bath immersion cooling, and energy consumption of data centers, as well as technical…read more
Calculation Corner: Thermal Interactions Between High-Power Packages and Heat Sinks, Part 1
December 6th, 2010
Bruce Guenin, PhD Associate Technical Editor The need to accommodate increasing chip power has led to improved package and heat sink designs having much lower thermal resistance values than previously. This has led to challenges…read more
calculation corner: a spreadsheet based matrix solution for a thermal resistance network: part 1
September 13th, 2010
Ross Wilcoxon Rockwell Collins Cedar Rapids, Iowa A thermal resistance network analysis begins by defining discrete points within a system, known as nodes, and the thermal resistance between each set of nodes. Boundary conditions for…read more
ElectronicsCooling Summer 2010 Print Issue
July 27th, 2010
Don’t miss out on the Summer 2010 issue of ElectronicsCooling, which includes feature articles on thermal design in silicon validation platforms, motor supports and small scale fans, and solar photovoltaic cell thermal measurements. If you…read more
Calculation Corner: Using Vendor Data to Estimate Thermoelectric Module Cooling Performance in An Application Environment
July 26th, 2010
The application of thermoelectric devices to cool electronic components has been of interest to thermal engineers for many years. Thermoelectric (TE) cooling modules offer the potential to either reduce component operating temperatures at a given…read more
Use of Power Law Regression in Packaging Thermal Calculations
August 1st, 2009
Introduction In today’s demanding business climate, thermal engineers are often called upon to produce thermal analyses rapidly. For example, there is frequently the need for a quick calculation of a JEDEC-standard thermal performance metric, such…read more
Using a Matrix Inverse Method to Solve a Thermal Resistance Network
May 1st, 2009
Today virtually all serious thermal analysis and design calculations for electronic packages are performed using various commercial flow and thermal conduction codes. Nonetheless, there are still many instances, especially in the early phases of a…read more
A Simple Method to Estimate Boiling Heat Sink Performance
February 1st, 2009
Introduction As most readers of ElectronicsCooling magazine are no doubt aware, fins may be added to a heat transfer surface to increase the effective heat transfer area and thereby reduce the base surface temperature for…read more
Power Map Calculations Using Image Sources and Superposition
November 1st, 2008
Introduction In the past, thermal engineers were content to calculate a single junction temperature in the thermal characterization of an integrated circuit chip in a package. In recent years, as power levels have increased, more…read more
Heat Spreading Calculations Using Thermal Circuit Elements
August 1st, 2008
Heat Spreading Calculations Using Thermal Circuit Elements Bruce Guenin, Associate Technical Editor Introduction In electronics cooling applications, there are numerous changes of scale from the chip level to the system level. This is characteristic of…read more
Estimating Dew Point Temperature For Water Cooling Applications
May 1st, 2008
Over the past several years thermal engineers and others in the computer industry have become acutely aware of the challenge of increasing power dissipation and the potential of liquid (principally water) cooling to provide a…read more
Estimating Thermal Resistance For Fin-To-Fin Thermal Couplers
February 1st, 2008
Introduction Most readers of ElectronicsCooling magazine are familiar with the use of fins to increase convective heat transfer area to achieve a lower thermal resistance from a component to the cooling fluid. This Calculation Corner…read more
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