Introduction This Calculation Corner continues Part I, published in the previous issue [1]. Part I described the construction of a typical flip-chip package configuration for high-power chips, consisting of a laminate assembly of materials adhesively…read more
Thermal Strain In Semiconductor Packages, Part I
August 1st, 2007
Introduction Silicon became the semiconductor of choice for ICs because of its electrical properties, not because of its mechanical properties. In the earliest days of ICs when chips were small and power levels were low,…read more
Estimating the effect of intercoolers for computer rack cooling
May 1st, 2007
Figure 1. Four board high rack with serial air flow configuration. Figure 2. Rack with intercoolers cooled by water flowing parallel to air flow direction. In the February 2007 issue of ElectronicsCooling the Calculation Corner…read more
Using a simple air recirculation model to explore computer rack cooling
February 1st, 2007
Figure 1. Schematic diagram of simple computer rack air recirculation model. Figure 2. Schematic diagram of computer rack air recirculation model with heat exchanger in rear of computer rack. In an article in the November…read more
Toward A Thermal Figure Of Merit For Multi-Chip Packages
November 1st, 2006
Toward A Thermal Figure Of Merit For Multi-Chip Packages Bruce M. Guenin, Ph.D., Associate Editor Introduction Last issue’s Calculation Corner dealt with methods for predicting the temperature of each chip in a Multi-Chip Package (MCP)…read more
So Many Chips, So Little Time; Device Temperature Prediction in Multi-Chip Packages
August 1st, 2006
Introduction The same trend that has led to ever-higher levels of integration of computation and processing functions on a single chip is now driving the integration of several chips into the same package. The use…read more
Comparing Heat Transfer Rates of Liquid Coolants Using the Mouromtseff Number
May 1st, 2006
As many readers of ElectronicsCooling are aware, there is a growing interest in the electronics cooling community in the possible use of liquid cooling. This interest is, of course, due to the trend of increased…read more
A Simple Thermal Resistance Model – Isoflux Versus Isothermal
February 1st, 2006
In most cases today thermal design for electronic products is performed with the aid of sophisticated computational fluid dynamics and heat transfer codes. Nonetheless, there may still be occasions when a thermal designer needs a…read more
A Funny Thing Happened On The Way To The Heatsink
August 1st, 2005
Introduction When faced with the task of calculating the temperature of an IC in a package, which has an external heat sink mounted to it, a thermal engineer usually obtains a values of three thermal…read more
Using an Equivalent Heat Transfer Coefficient to Model Fins on a Fin
May 1st, 2005
Many readers of ElectronicsCooling are probably familiar with the use of fin efficiency formulas to estimate the thermal resistance of the commonly used parallel plate fin heat sink. Given the heat transfer coefficient, h, acting…read more
Estimating Temperatures in an Air-cooled Closed Box Electronics Enclosure
February 1st, 2005
Introduction In the majority of air-cooling applications, openings or vents are provided in the enclosure or box in which the electronic components are housed. The required cooling air is drawn in from outside the box…read more
Entrance Effects For Heat Flow Into A Multi-Layer Printed Circuit Board
November 1st, 2004
Introduction Since their introduction, multilayer printed circuit boards have provided a significant benefit to the thermal management of IC packages. As is widely recognized, the power and ground planes in these boards function as fins…read more
Thermal Vias – A Packaging Engineer’s Best Friend
August 1st, 2004
Introduction In the 1990′s, with the advent of surface mounting of semiconductor packages, multilayer printed circuit boards and multilayer substrates for Ball Grid Array packages were introduced. In order to create electrical interconnections between the…read more
Simple Formulas for Estimating Thermal Spreading Resistance
May 1st, 2004
A problem commonly encountered in the thermal analysis of electronic packages is that of thermal spreading resistance. Thermal spreading resistance occurs as heat flows by conduction between a source and a sink with different cross-sectional…read more
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